Issued Patents All Time
Showing 1–25 of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424256 | Circuit design and layout with high embedded memory density | Fa-Shen Jiang, Hsia-Wei Chen, Hai-Dang Trinh, Cheng-Yuan Tsai | 2025-09-23 |
| 12408448 | Deep trench isolation structure and methods for fabrication thereof | Bi-Shen Lee, Chia-Wei Hu, Hai-Dang Trinh, Min-Ying Tsai, Ching-I Li +1 more | 2025-09-02 |
| 12364171 | Resistive memory cell with switching layer comprising one or more dopants | Fa-Shen Jiang, Cheng-Yuan Tsai, Hai-Dang Trinh, Hsing-Lien Lin, Bi-Shen Lee | 2025-07-15 |
| 12356631 | FeRAM with laminated ferroelectric film and method forming same | Bi-Shen Lee, Yi Yang Wei, Hsing-Lien Lin, Cheng-Yuan Tsai, Hai-Dang Trinh | 2025-07-08 |
| 12349366 | Interface film to mitigate size effect of memory device | Bi-Shen Lee, Yi Yang Wei, Hai-Dang Trinh, Cheng-Yuan Tsai | 2025-07-01 |
| 12341019 | Anti-oxidation layer to prevent dielectric loss from planarization process | Zhen Yu Guan | 2025-06-24 |
| 12334317 | Remote plasma ultraviolet enhanced deposition | Hai-Dang Trinh, Fa-Shen Jiang | 2025-06-17 |
| 12310036 | Threshold voltage-modulated memory device using variable-capacitance and methods of forming the same | Fa-Shen Jiang, Hsia-Wei Chen, Hai-Dang Trinh | 2025-05-20 |
| 12302663 | Bond pad structure for bonding improvement | Chin-Wei Liang, Sheng-Chau Chen, Sheng-Chan Li | 2025-05-13 |
| 12295267 | Semiconductor device and method of manufacturing the same | Bi-Shen Lee, Hai-Dang Trinh | 2025-05-06 |
| 12290003 | Conductive structure connection with interconnect structure | Sheng-Chau Chen, Cheng-Tai Hsiao, Cheng-Yuan Tsai | 2025-04-29 |
| 12266604 | Techniques to inhibit delamination from flowable gap-fill dielectric | Hsing-Lien Lin, Chin-Wei Liang, Ching Ju Yang | 2025-04-01 |
| 12255062 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2025-03-18 |
| 12240076 | Conditioner disk, chemical mechanical polishing device, and method | Hsien Hua Shen | 2025-03-04 |
| 12232336 | Threshold voltage-modulated memory device using variable-capacitance and methods of forming the same | Fa-Shen Jiang, Hsia-Wei Chen, Hai-Dang Trinh | 2025-02-18 |
| 12232434 | Multi-doped data storage structure configured to improve resistive memory cell performance | Bi-Shen Lee, Hai-Dang Trinh, Fa-Shen Jiang | 2025-02-18 |
| 12191250 | Method of forming bottom electrode via for memory device | Zhen Yu Guan, Sheng-Wen Fu | 2025-01-07 |
| 12185640 | MRAM MTJ with directly coupled top electrode connection | Sheng-Chau Chen, Cheng-Tai Hsiao, Cheng-Yuan Tsai | 2024-12-31 |
| 12183571 | Integrated aligned stealth laser for wafer edge trimming process | Ming-Tung Wu, Tung-He Chou | 2024-12-31 |
| 12160995 | Wakeup free approach to improve the ferroelectricity of FeRAM using a stressor layer | Bi-Shen Lee, Tzu-Yu Lin, Yi Yang Wei, Hai-Dang Trinh, Cheng-Yuan Tsai | 2024-12-03 |
| 12137572 | Ferroelectric memory device and method of manufacturing the same | Yi Yang Wei, Tzu-Yu Lin, Bi-Shen Lee, Hai-Dang Trinh, Hsing-Lien Lin | 2024-11-05 |
| 12132066 | Capping structure along image sensor element to mitigate damage to active layer | Chun-Kai Lan, Hai-Dang Trinh | 2024-10-29 |
| 12127483 | Doped sidewall spacer/etch stop layer for memory | Bi-Shen Lee, Hai-Dang Trinh, Cheng-Yuan Tsai | 2024-10-22 |
| 12113090 | Bond pad structure for bonding improvement | Chin-Wei Liang, Sheng-Chau Chen, Sheng-Chan Li | 2024-10-08 |
| 12107004 | In-situ CMP self-assembled monolayer for enhancing metal-dielectric adhesion and preventing metal diffusion | Zhen Yu Guan | 2024-10-01 |