Issued Patents All Time
Showing 51–75 of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527713 | Top electrode via with low contact resistance | Bi-Shen Lee, Hai-Dang Trinh, Tzu-Chung Tsai, Yao-Wen Chang | 2022-12-13 |
| 11495532 | Techniques to inhibit delamination from flowable gap-fill dielectric | Hsing-Lien Lin, Chin-Wei Liang, Ching Ju Yang | 2022-11-08 |
| 11430951 | Resistive memory cell with switching layer comprising one or more dopants | Fa-Shen Jiang, Cheng-Yuan Tsai, Hai-Dang Trinh, Hsing-Lien Lin, Bi-Shen Lee | 2022-08-30 |
| 11404638 | Multi-doped data storage structure configured to improve resistive memory cell performance | Bi-Shen Lee, Hai-Dang Trinh, Fa-Shen Jiang | 2022-08-02 |
| 11393833 | Ferroelectric random access memory device with seed layer | Bi-Shen Lee, Hsing-Lien Lin, Yi Yang Wei | 2022-07-19 |
| 11367623 | Structure and method to expose memory cells with different sizes | Sheng-Chau Chen, Cheng-Tai Hsiao, Cheng-Yuan Tsai, Yao-Wen Chang | 2022-06-21 |
| 11351648 | Chemical mechanical polishing apparatus, slurry, and method of using the same | Tung-He Chou | 2022-06-07 |
| 11342199 | Wafer carrier assembly | Ming-Tung Wu | 2022-05-24 |
| 11282697 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2022-03-22 |
| 11183394 | Structure and method to expose memory cells with different sizes | Sheng-Chau Chen, Cheng-Tai Hsiao, Cheng-Yuan Tsai, Yao-Wen Chang | 2021-11-23 |
| 11183627 | MRAM MTJ top electrode connection | Sheng-Chau Chen, Cheng-Tai Hsiao, Cheng-Yuan Tsai | 2021-11-23 |
| 11152426 | Memory device using an etch stop dielectric layer and methods for forming the same | Cheng-Tai Hsiao, Yen-Chang Chu | 2021-10-19 |
| 11133231 | CMP apparatus and method for estimating film thickness | Yu-Min Chen, Chin-Wei Liang, Sheng-Chau Chen | 2021-09-28 |
| 11121315 | Structure improving reliability of top electrode contact for resistance switching RAM having cells of varying height | Cheng-Tai Hsiao, Sheng-Chau Chen | 2021-09-14 |
| 11081334 | Particle prevention in wafer edge trimming | Tung-He Chou, Sheng-Chau Chen, Ming-Tung Wu | 2021-08-03 |
| 11049767 | Semiconductor device and methods of manufacturing thereof | Tsai-Ming Huang, Wei-Chieh Huang, Yen-Chang Chu, Cheng-Che CHUNG, Chin-Wei Liang +4 more | 2021-06-29 |
| 10991758 | Semiconductor structure | Harry-Hak-Lay Chuang, Kuei-Hung Shen, Cheng-Yuan Tsai, Ru-Liang Lee | 2021-04-27 |
| 10967479 | Chemical mechanical polishing system and method | Chin-Wei Liang, Yen-Chang Chu | 2021-04-06 |
| 10879077 | Planarization apparatus and planarization method thereof | Ming-Tung Wu, Chun-Kai Lan, Tung-He Chou | 2020-12-29 |
| 10857651 | Apparatus of chemical mechanical polishing and operating method thereof | Chun-Kai Lan, Tung-He Chou, Ming-Tung Wu, Sheng-Chau Chen | 2020-12-08 |
| 10790189 | 3D integrated circuit and methods of forming the same | Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Lan-Lin Chao, Yeur-Luen Tu +2 more | 2020-09-29 |
| 10727077 | Structure and method to expose memory cells with different sizes | Sheng-Chau Chen, Cheng-Tai Hsiao, Cheng-Yuan Tsai, Yao-Wen Chang | 2020-07-28 |
| 10665449 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2020-05-26 |
| 10529913 | Techniques for MRAM MTJ top electrode connection | Sheng-Chau Chen, Cheng-Tai Hsiao, Cheng-Yuan Tsai | 2020-01-07 |
| 10510563 | Wafer carrier assembly | Ming-Tung Wu | 2019-12-17 |