Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381181 | Semiconductor device including a plurality of dielectric materials between semiconductor dies and methods of forming the same | Jen-Yuan Chang | 2025-08-05 |
| 12338943 | Apparatus for storing and transporting semiconductor elements, and method of making the same | Tse-Lun Hsu, Fang-Yu Liu | 2025-06-24 |
| 12322623 | Semiconductor die carrier structure | Ping-Cheng Ko, Fang-Yu Liu, Jhih-Yuan Yang | 2025-06-03 |
| 12322679 | Semiconductor die including through substrate via barrier structure and methods for forming the same | Jen-Yuan Chang, Chia-Ping Lai, Shih-Chang Chen, Chien-Chang Lee | 2025-06-03 |
| 12278167 | Semiconductor die including through substrate via barrier structure and methods for forming the same | Jen-Yuan Chang, Chia-Ping Lai, Shih-Chang Chen, Chien-Chang Lee | 2025-04-15 |
| 12272724 | Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the same | Jen-Yuan Chang, Chien-Chang Lee, Chia-Ping Lai | 2025-04-08 |
| 12249586 | Film structure for bond pad | Julie Yang, Chii-Ming Wu, Yao-Wen Chang | 2025-03-11 |
| 12239035 | Resistive memory cell having a low forming voltage | Hai-Dang Trinh, Chii-Ming Wu, Hsing-Lien Lin, Fa-Shen Jiang, Bi-Shen Lee | 2025-02-25 |
| 12222542 | Photonic device on a semiconductor-on-insulator substrate and method of manufacturing thereof | Yueh-Ying Lee, Chien-Ying Wu, Jhih-Ming Lin | 2025-02-11 |
| 12218180 | Multi-layered resistor with a tight temperature coefficient of resistance tolerance | Szu-Hsien Lo, Che-Hung Liu | 2025-02-04 |
| 12102019 | Data storage structure for improving memory cell reliability | Hai-Dang Trinh, Chii-Ming Wu, Cheng-Yuan Tsai, Fa-Shen Jiang | 2024-09-24 |
| 12094925 | Three-dimensional device structure including embedded integrated passive device and methods of making the same | Jen-Yuan Chang, Chien-Chang Lee, Chia-Ping Lai | 2024-09-17 |
| 11923403 | Multi-layered resistor with a tight temperature coefficient of resistance tolerance | Szu-Hsien Lo, Che-Hung Liu | 2024-03-05 |
| 11908838 | Three-dimensional device structure including embedded integrated passive device and methods of making the same | Jen-Yuan Chang, Chien-Chang Lee, Chia-Ping Lai | 2024-02-20 |
| 11881421 | Semiconductor die carrier structure | Ping-Cheng Ko, Fang-Yu Liu, Jhih-Yuan Yang | 2024-01-23 |
| 11855130 | Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the same | Jen-Yuan Chang, Chien-Chang Lee, Chia-Ping Lai | 2023-12-26 |
| 11742325 | Semiconductor device including a plurality of dielectric materials between semiconductor dies and methods of forming the same | Jen-Yuan Chang | 2023-08-29 |
| 11721794 | Method for manufacturing reflective structure | Chia-Hua Lin, Yao-Wen Chang, Chii-Ming Wu, Cheng-Yuan Tsai, Eugene Chen | 2023-08-08 |
| 11716913 | Data storage structure for improving memory cell reliability | Hai-Dang Trinh, Chii-Ming Wu, Cheng-Yuan Tsai, Fa-Shen Jiang | 2023-08-01 |
| 11527713 | Top electrode via with low contact resistance | Bi-Shen Lee, Hai-Dang Trinh, Hsun-Chung Kuang, Yao-Wen Chang | 2022-12-13 |
| 11527717 | Resistive memory cell having a low forming voltage | Hai-Dang Trinh, Chii-Ming Wu, Hsing-Lien Lin, Fa-Shen Jiang, Bi-Shen Lee | 2022-12-13 |
| 11322464 | Film structure for bond pad | Julie Yang, Chii-Ming Wu, Yao-Wen Chang | 2022-05-03 |
| 11309491 | Data storage structure for improving memory cell reliability | Hai-Dang Trinh, Chii-Ming Wu, Cheng-Yuan Tsai, Fa-Shen Jiang | 2022-04-19 |
| 11257997 | Semiconductor structure | Chia-Hua Lin, Yao-Wen Chang, Chii-Ming Wu, Cheng-Yuan Tsai, Eugene Chen | 2022-02-22 |
| 11131025 | Wireless camera wafer for vacuum chamber diagnostics | Chii-Ming Wu, Hai-Dang Trinh | 2021-09-28 |