Issued Patents All Time
Showing 1–25 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417987 | Semiconductor die including guard ring structure and three-dimensional device structure including the same | Jen-Yuan Chang, Chia-Ping Lai | 2025-09-16 |
| 12362323 | Three-dimensional integrated circuit | Jen-Yuan Chang, Chia-Ping Lai | 2025-07-15 |
| 12322679 | Semiconductor die including through substrate via barrier structure and methods for forming the same | Jen-Yuan Chang, Chia-Ping Lai, Shih-Chang Chen, Tzu-Chung Tsai | 2025-06-03 |
| 12278167 | Semiconductor die including through substrate via barrier structure and methods for forming the same | Jen-Yuan Chang, Chia-Ping Lai, Shih-Chang Chen, Tzu-Chung Tsai | 2025-04-15 |
| 12272724 | Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the same | Jen-Yuan Chang, Chia-Ping Lai, Tzu-Chung Tsai | 2025-04-08 |
| 12261133 | Interposer with warpage-relief trenches | Tsung-Yang Hsieh, Chia-Ping Lai, Wen-Chung Lu, Cheng-Kang Huang, Mei-Shih Kuo +1 more | 2025-03-25 |
| 12169308 | Method of using fiber to chip coupler and method of making | Sui-Ying Hsu, Yuehying Lee, Chien-Ying Wu, Chen-Hao Huang, Chia-Ping Lai | 2024-12-17 |
| 12153255 | Method of making photonic device | Chien-Ying Wu, Yuehying Lee, Sui-Ying Hsu, Chen-Hao Huang, Chia-Ping Lai | 2024-11-26 |
| 12094868 | Shielded deep trench capacitor structure and methods of forming the same | Jen-Yuan Chang, Chia-Ping Lai | 2024-09-17 |
| 12094925 | Three-dimensional device structure including embedded integrated passive device and methods of making the same | Jen-Yuan Chang, Chia-Ping Lai, Tzu-Chung Tsai | 2024-09-17 |
| 12072534 | Fiber to chip coupler and method of using | Sui-Ying Hsu, Yuehying Lee, Chien-Ying Wu, Chen-Hao Huang, Chia-Ping Lai | 2024-08-27 |
| 12050348 | Fiber to chip coupler and method of making the same | Chen-Hao Huang, Hau-Yan Lu, Sui-Ying Hsu, Yuehying Lee, Chien-Ying Wu +1 more | 2024-07-30 |
| 12040242 | Three-dimensional device structure including seal ring connection circuit | Jen-Yuan Chang, Chia-Ping Lai | 2024-07-16 |
| 12027475 | Semiconductor die including guard ring structure and three-dimensional device structure including the same | Jen-Yuan Chang, Chia-Ping Lai | 2024-07-02 |
| 12009405 | Deep trench capacitor including a compact contact region and methods of forming the same | Jen-Yuan Chang, Chia-Ping Lai | 2024-06-11 |
| 11973040 | Interposer with warpage-relief trenches | Tsung-Yang Hsieh, Chia-Ping Lai, Wen-Chung Lu, Cheng-Kang Huang, Mei-Shih Kuo +1 more | 2024-04-30 |
| 11908838 | Three-dimensional device structure including embedded integrated passive device and methods of making the same | Jen-Yuan Chang, Chia-Ping Lai, Tzu-Chung Tsai | 2024-02-20 |
| 11892681 | Fiber to chip coupler and method of making the same | Chen-Hao Huang, Hau-Yan Lu, Sui-Ying Hsu, Yuehying Lee, Chien-Ying Wu +1 more | 2024-02-06 |
| 11892678 | Photonic device and method of making same | Chien-Ying Wu, Yuehying Lee, Sui-Ying Hsu, Chen-Hao Huang, Chia-Ping Lai | 2024-02-06 |
| 11855130 | Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the same | Jen-Yuan Chang, Chia-Ping Lai, Tzu-Chung Tsai | 2023-12-26 |
| 11776896 | Capacitor device and manufacturing method thereof | Jen-Yuan Chang, Chia-Ping Lai | 2023-10-03 |
| 11740409 | Photonic device | Sui-Ying Hsu, Yueh-Ying Lee, Chien-Ying Wu, Chen-Hao Huang, Chia-Ping Lai | 2023-08-29 |
| 11728288 | Semiconductor die including guard ring structure and three-dimensional device structure including the same | Jen-Yuan Chang, Chia-Ping Lai | 2023-08-15 |
| 11442230 | Silicon photonics coupling structure using an etch stop layer and methods of forming the same | Yueh-Ying Lee, Chien-Ying Wu, Sui-Ying Hsu, Chen-Hao Huang, Chia-Ping Lai | 2022-09-13 |
| 11327228 | Photonic device and fabrication method thereof | Sui-Ying Hsu, Yueh-Ying Lee, Chien-Ying Wu, Chen-Hao Huang, Chia-Ping Lai | 2022-05-10 |