Issued Patents All Time
Showing 76–89 of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10350726 | Chemical mechanical polishing system and method | Chin-Wei Liang, Yen-Chang Chu | 2019-07-16 |
| 10304903 | Semiconductor structure | Harry-Hak-Lay Chuang, Kuei-Hung Shen, Cheng-Yuan Tsai, Ru-Liang Lee | 2019-05-28 |
| 10181441 | Through via structure and manufacturing method thereof | Cheng-Tai Hsiao | 2019-01-15 |
| 10163651 | Structure and method to expose memory cells with different sizes | Sheng-Chau Chen, Cheng-Tai Hsiao, Cheng-Yuan Tsai, Yao-Wen Chang | 2018-12-25 |
| 10128209 | Wafer bonding process and structure | Ping-Yin Liu, Lan-Lin Chao, Cheng-Tai Hsiao, Xin-Hua Huang | 2018-11-13 |
| 10090196 | 3D integrated circuit and methods of forming the same | Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Lan-Lin Chao, Yeur-Luen Tu +2 more | 2018-10-02 |
| 9893120 | Semiconductor structure and method of forming the same | Harry-Hak-Lay Chuang, Kuei-Hung Shen, Cheng-Yuan Tsai, Ru-Liang Lee | 2018-02-13 |
| 9786628 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou +4 more | 2017-10-10 |
| 9502396 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou +4 more | 2016-11-22 |
| 9425155 | Wafer bonding process and structure | Ping-Yin Liu, Cheng-Tai Hsiao, Xin-Hua Huang, Lan-Lin Chao | 2016-08-23 |
| 9257399 | 3D integrated circuit and methods of forming the same | Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Lan-Lin Chao, Yeur-Luen Tu +2 more | 2016-02-09 |
| 8810048 | 3D IC and 3D CIS structure | — | 2014-08-19 |
| 8334187 | Hard mask for thin film resistor manufacture | Li-Wen Chang, Der-Chyang Yeh, Chung-Yi Yu, Hua-Chou Tseng, Chih-Ping Chao +2 more | 2012-12-18 |
| 8080461 | Method of making a thin film resistor | Der-Chyang Yeh, Ming Chyi Liu, Chung-Yi Yu, Chih-Ping Chao, Alexander Kalnitsky | 2011-12-20 |