Issued Patents All Time
Showing 26–50 of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12075626 | Memory window of MFM MOSFET for small cell size | Hai-Dang Trinh, Yi Yang Wei, Bi-Shen Lee, Fa-Shen Jiang, Cheng-Yuan Tsai | 2024-08-27 |
| 12075636 | Threshold voltage-modulated memory device using variable-capacitance and methods of forming the same | Fa-Shen Jiang, Hsia-Wei Chen, Hai-Dang Trinh | 2024-08-27 |
| 12069867 | Ferroelectric random access memory device with seed layer | Bi-Shen Lee, Hsing-Lien Lin, Yi Yang Wei | 2024-08-20 |
| 12035537 | Interface film to mitigate size effect of memory device | Bi-Shen Lee, Yi Yang Wei, Hai-Dang Trinh, Cheng-Yuan Tsai | 2024-07-09 |
| 11967611 | Multilayer structure, capacitor structure and electronic device | Hai-Dang Trinh, Yi Yang Wei, Fa-Shen Jiang, Bi-Shen Lee | 2024-04-23 |
| 11961545 | Circuit design and layout with high embedded memory density | Fa-Shen Jiang, Hsia-Wei Chen, Hai-Dang Trinh, Cheng-Yuan Tsai | 2024-04-16 |
| 11916127 | Multi-layer electrode to improve performance of ferroelectric memory device | Yi Yang Wei, Bi-Shen Lee, Hsin-Yu Lai, Hai-Dang Trinh, Hsing-Lien Lin | 2024-02-27 |
| 11901171 | Integrated aligned stealth laser with blade and grinding apparatus for wafer edge trimming process | Ming-Tung Wu, Tung-He Chou | 2024-02-13 |
| 11895933 | Resistive memory cell with switching layer comprising one or more dopants | Fa-Shen Jiang, Cheng-Yuan Tsai, Hai-Dang Trinh, Hsing-Lien Lin, Bi-Shen Lee | 2024-02-06 |
| 11887929 | Techniques to inhibit delamination from flowable gap-fill dielectric | Hsing-Lien Lin, Chin-Wei Liang, Ching Ju Yang | 2024-01-30 |
| 11869916 | Bond pad structure for bonding improvement | Chin-Wei Liang, Sheng-Chau Chen, Sheng-Chan Li | 2024-01-09 |
| 11856801 | Threshold voltage-modulated memory device using variable-capacitance and methods of forming the same | Fa-Shen Jiang, Hsia-Wei Chen, Hai-Dang Trinh | 2023-12-26 |
| 11854795 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2023-12-26 |
| 11854822 | Anti-oxidation layer to prevent dielectric loss from planarization process | Zhen Yu Guan | 2023-12-26 |
| 11844226 | FeRAM with laminated ferroelectric film and method forming same | Bi-Shen Lee, Yi Yang Wei, Hsing-Lien Lin, Cheng-Yuan Tsai, Hai-Dang Trinh | 2023-12-12 |
| 11810817 | In-situ CMP self-assembled monolayer for enhancing metal-dielectric adhesion and preventing metal diffusion | Zhen Yu Guan | 2023-11-07 |
| 11787012 | Conditioner disk, chemical mechanical polishing device, and method | Hsien Hua Shen | 2023-10-17 |
| 11737280 | Wakeup free approach to improve the ferroelectricity of FeRAM using a stressor layer | Bi-Shen Lee, Tzu-Yu Lin, Yi Yang Wei, Hai-Dang Trinh, Cheng-Yuan Tsai | 2023-08-22 |
| 11723212 | Memory window of MFM MOSFET for small cell size | Hai-Dang Trinh, Yi Yang Wei, Bi-Shen Lee, Fa-Shen Jiang, Cheng-Yuan Tsai | 2023-08-08 |
| 11682692 | Hard mask layer below via structure in display device | Chia-Hua Lin, Yu-Hsing Chang, Yao-Wen Chang | 2023-06-20 |
| 11665909 | FeRAM with laminated ferroelectric film and method forming same | Bi-Shen Lee, Yi Yang Wei, Hsing-Lien Lin, Cheng-Yuan Tsai, Hai-Dang Trinh | 2023-05-30 |
| 11610927 | Capping structure along image sensor element to mitigate damage to active layer | Chun-Kai Lan, Hai-Dang Trinh | 2023-03-21 |
| 11605534 | Particle prevention in wafer edge trimming | Tung-He Chou, Sheng-Chau Chen, Ming-Tung Wu | 2023-03-14 |
| 11594679 | Structure improving reliability of top electrode contact for resistance switching RAM having cells of varying height | Cheng-Tai Hsiao, Sheng-Chau Chen | 2023-02-28 |
| 11545202 | Circuit design and layout with high embedded memory density | Fa-Shen Jiang, Hsia-Wei Chen, Hai-Dang Trinh, Cheng-Yuan Tsai | 2023-01-03 |