Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341019 | Anti-oxidation layer to prevent dielectric loss from planarization process | Hsun-Chung Kuang | 2025-06-24 |
| 12191250 | Method of forming bottom electrode via for memory device | Sheng-Wen Fu, Hsun-Chung Kuang | 2025-01-07 |
| 12107004 | In-situ CMP self-assembled monolayer for enhancing metal-dielectric adhesion and preventing metal diffusion | Hsun-Chung Kuang | 2024-10-01 |
| 11854822 | Anti-oxidation layer to prevent dielectric loss from planarization process | Hsun-Chung Kuang | 2023-12-26 |
| 11810817 | In-situ CMP self-assembled monolayer for enhancing metal-dielectric adhesion and preventing metal diffusion | Hsun-Chung Kuang | 2023-11-07 |
| 10336692 | Method of forming paracyclophane containing functional group with disulfide bond | Hsien-Yeh Chen, Chih-Yu Wu | 2019-07-02 |
| 10246412 | Chemical film on substrate and method of forming the same, method of forming paracyclophane containing functional ground with disulfide bond | Hsien-Yeh Chen, Chih-Yu Wu | 2019-04-02 |