Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12408448 | Deep trench isolation structure and methods for fabrication thereof | Bi-Shen Lee, Chia-Wei Hu, Hai-Dang Trinh, Ching-I Li, Hsun-Chung Kuang +1 more | 2025-09-02 |
| 12364046 | Photodiode structure for image sensor | Ching-I Li | 2025-07-15 |
| 12364048 | Conductive contact for ion through-substrate via | Cheng-Ta Wu, Yeur-Luen Tu | 2025-07-15 |
| 12349492 | Photodiode structure for image sensor | Ching-I Li | 2025-07-01 |
| 12328886 | Metal-insulator-metal capacitor and methods of manufacturing | Chih-Ping Chang, Ching-I Li | 2025-06-10 |
| 12191191 | Semiconductor structure and manufacturing method thereof | Yeur-Luen Tu | 2025-01-07 |
| 12087801 | Deep trench isolations and methods of forming the same | Cheng-Hsien Chou, Chih-Yu Lai, Shih Pei Chou, Yen-Ting Chiang, Hsiao-Hui Tseng | 2024-09-10 |
| 12080738 | Image sensor having stacked metal oxide films as fixed charge film | Chih-Yu Lai, Yeur-Luen Tu, Hai-Dang Trinh, Cheng-Yuan Tsai | 2024-09-03 |
| 11929379 | Conductive contact for ion through-substrate via | Cheng-Ta Wu, Yeur-Luen Tu | 2024-03-12 |
| 11869761 | Back-side deep trench isolation structure for image sensor | Yu-Hung Cheng, Chun-Tsung Kuo, Jiech-Fun Lu, Chiao-Chun Hsu, Ching-I Li | 2024-01-09 |
| 11817469 | Light absorbing layer to enhance P-type diffusion for DTI in image sensors | Yu-Hung Cheng, Ching-I Li, Yu Fang, Yu-Yao Hsia | 2023-11-14 |
| 11784204 | Enhanced trench isolation structure | Cheng-Te Lee, Rei-Lin Chu, Ching-I Li, Chung-Yi Yu | 2023-10-10 |
| 11545513 | Image sensor having improved full well capacity and related method of formation | Yu-Hung Cheng, Shyh-Fann Ting, Yen-Ting Chiang, Yeur-Luen Tu | 2023-01-03 |
| 11398516 | Conductive contact for ion through-substrate via | Cheng-Ta Wu, Yeur-Luen Tu | 2022-07-26 |
| 11232975 | Semiconductor-on-insulator (SOI) substrate having dielectric structures that increase interface bonding strength | Yeur-Luen Tu | 2022-01-25 |
| 11217621 | Deep trench isolations and methods of forming the same | Cheng-Hsien Chou, Chih-Yu Lai, Shih Pei Chou, Yen-Ting Chiang, Hsiao-Hui Tseng | 2022-01-04 |
| 11171039 | Composite semiconductor substrate, semiconductor device and method for manufacturing the same | Cheng-Ta Wu, Yu-Hung Cheng, Yeur-Luen Tu | 2021-11-09 |
| 11101307 | Image sensor having stacked conformal films | Chih-Yu Lai, Yeur-Luen Tu, Hai-Dang Trinh, Cheng-Yuan Tsai | 2021-08-24 |
| 11069733 | Image sensor having improved full well capacity and related method of formation | Yu-Hung Cheng, Shyh-Fann Ting, Yen-Ting Chiang, Yeur-Luen Tu | 2021-07-20 |
| 10971534 | Image sensor having improved full well capacity and related method of formation | Yu-Hung Cheng, Shyh-Fann Ting, Yen-Ting Chiang, Yeur-Luen Tu | 2021-04-06 |
| 10930547 | Semiconductor structure and manufacturing method thereof | Yeur-Luen Tu | 2021-02-23 |
| 10923503 | Semiconductor-on-insulator (SOI) substrate comprising a trap-rich layer with small grain sizes | Yu-Hung Cheng, Cheng-Ta Wu, Yeur-Luen Tu, Alex Usenko | 2021-02-16 |
| 10867834 | Semiconductor structure and manufacturing method thereof | Yeur-Luen Tu | 2020-12-15 |
| 10658410 | Image sensor having improved full well capacity and related method of formation | Yu-Hung Cheng, Shyh-Fann Ting, Yen-Ting Chiang, Yeur-Luen Tu | 2020-05-19 |
| 10395974 | Method for forming a thin semiconductor-on-insulator (SOI) substrate | Shih Pei Chou, Hung-Wen Hsu, Jiech-Fun Lu, Yu-Hung Cheng, Yung-Lung Lin | 2019-08-27 |