TH

Tsung-Lin Hsieh

TSMC: 2 patents #6,667 of 12,232Top 55%
CS Chi Mei Communication Systems: 1 patents #135 of 370Top 40%
Foxconn: 1 patents #3,106 of 5,504Top 60%
Overall (All Time): #1,089,237 of 4,157,543Top 30%
4
Patents All Time

Issued Patents All Time

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
12358783 Wire-bond damper for shock absorption Wei-Jhih Mao, Shang-Ying Tsai, Kuei-Sung Chang, Chun-Wen Cheng 2025-07-15
11987494 Wire-bond damper for shock absorption Wei-Jhih Mao, Shang-Ying Tsai, Kuei-Sung Chang, Chun-Wen Cheng 2024-05-21
8270182 Mobile phone with metal hinged shield Hsin-Hung Liu 2012-09-18
8013796 Dual-band antenna Hsin-Hung Liu 2011-09-06