Issued Patents All Time
Showing 1–25 of 138 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272855 | Semiconductor device and methods, where first and second transmission lines are surrounded by first and second high-k dielectric materials | Jiun Yi Wu, Chien-Hsun Lee, Chewn-Pu Jou | 2025-04-08 |
| 12245361 | Interconnect structure having conductor extending along dielectric block | Jiun Yi Wu, Chien-Hsun Lee, Chewn-Pu Jou | 2025-03-04 |
| 11765975 | Thermocouple device | Ming-Hsien Tsai, Shang-Ying Tsai, Shih-Ming Yang, Jheng-Yuan Wang, Ming-De Chen | 2023-09-19 |
| 11737205 | Interconnect structure having conductor extending along dielectric block | Jiun Yi Wu, Chien-Hsun Lee, Chewn-Pu Jou | 2023-08-22 |
| 11711056 | Method of using varainductor having ground and floating planes | Yi-Hsuan Liu, Hsieh-Hung Hsieh, Chewn-Pu Jou | 2023-07-25 |
| 11664566 | Semiconductor device and method, where a dielectric material directly contacts a high-k dielectric material and first and second transmission lines | Jiun Yi Wu, Chien-Hsun Lee, Chewn-Pu Jou | 2023-05-30 |
| 11457525 | Interconnect structure having conductor extending along dielectric block | Jiun Yi Wu, Chien-Hsun Lee, Chewn-Pu Jou | 2022-09-27 |
| 11362624 | Varainductor having ground and floating planes and method of using | Yi-Hsuan Liu, Hsieh-Hung Hsieh, Chewn-Pu Jou | 2022-06-14 |
| 11258151 | Semiconductor device having a high-k dielectric material disposed beyween first and second transmission lines and a dielectric directly contacting the high-k dielectric material | Jiun Yi Wu, Chien-Hsun Lee, Chewn-Pu Jou | 2022-02-22 |
| 11251354 | Thermocouple device | Ming-Hsien Tsai, Shang-Ying Tsai, Shih-Ming Yang, Jheng-Yuan Wang, Ming-De Chen | 2022-02-15 |
| 11128285 | Input/output circuit and method | Chan-Hong Chern, Tsung-Ching Huang, Chih-Chang Lin, Ming-Chieh Huang | 2021-09-21 |
| 10854708 | Capacitor having multiple graphene structures | Chewn-Pu Jou, Chih-Hsin Ko, Po-Wen Chiu, Chao-Ching Cheng, Chun-Chieh Lu +3 more | 2020-12-01 |
| 10855280 | Input/output circuit and method | Chan-Hong Chern, Tsung-Ching Huang, Chih-Chang Lin, Ming-Chieh Huang | 2020-12-01 |
| 10785865 | Interconnect structure and method of manufacturing the same | Jiun Yi Wu, Chien-Hsun Lee, Chewn-Pu Jou | 2020-09-22 |
| 10756672 | Varainductor having ground and floating planes | Yi-Hsuan Liu, Hsieh-Hung Hsieh, Chewn-Pu Jou | 2020-08-25 |
| 10686434 | Input/output circuit | Chan-Hong Chern, Tsung-Ching Huang, Chih-Chang Lin, Ming-Chieh Huang | 2020-06-16 |
| 10673437 | Level shifting circuit and method | Chan-Hong Chern, Tsung-Ching Huang, Chih-Chang Lin, Ming-Chieh Huang | 2020-06-02 |
| 10672969 | Thermocouple device | Ming-Hsien Tsai, Shang-Ying Tsai, Shih-Ming Yang, Jheng-Yuan Wang, Ming-De Chen | 2020-06-02 |
| 10530030 | Semiconductor device having first and second transmission lines with a high-K dielectric material disposed between the first and second transmission lines | Jiun Yi Wu, Chien-Hsun Lee, Chewn-Pu Jou | 2020-01-07 |
| 10510827 | Capacitor having multiple graphene structures | Chewn-Pu Jou, Chih-Hsin Ko, Po-Wen Chiu, Chao-Ching Cheng, Chun-Chieh Lu +3 more | 2019-12-17 |
| 10289777 | Integrated circuit designs based on temperature distribution determination | Sa-Lly Liu, Szu-Lin Liu, Jaw-Juinn Horng | 2019-05-14 |
| 10187046 | Input/output circuit | Chan-Hong Chern, Tsung-Ching Huang, Chih-Chang Lin, Ming-Chieh Huang | 2019-01-22 |
| 10177764 | Input/output circuit | Chan-Hong Chern, Tsung-Ching Huang, Chih-Chang Lin, Ming-Chieh Huang | 2019-01-08 |
| 10165208 | Method for reducing blooming in image sensor during idle period | Kuo-Yu Chou, Calvin Yi-Ping Chao, Honyih Tu, Jhy-Jyi Sze | 2018-12-25 |
| 10050104 | Capacitor having a graphene structure, semiconductor device including the capacitor and method of forming the same | Chewn-Pu Jou, Chih-Hsin Ko, Po-Wen Chiu, Chao-Ching Cheng, Chun-Chieh Lu +3 more | 2018-08-14 |