SL

Sa-Lly Liu

TSMC: 15 patents #2,074 of 12,232Top 20%
SE Seiko Epson: 3 patents #3,864 of 7,774Top 50%
ST South China University Of Technology: 2 patents #121 of 947Top 15%
Overall (All Time): #201,691 of 4,157,543Top 5%
21
Patents All Time

Issued Patents All Time

Showing 1–21 of 21 patents

Patent #TitleCo-InventorsDate
12297300 Hyaluronic acid-based zwitterionic polymer brush, preparation method thereof, and use thereof Li Ren, Renjian Xie 2025-05-13
10889898 Method for improving blood compatibility of material surface by using controllable grafting technique Li Ren, Yingjun Wang, Jian Zheng, Lin Wang 2021-01-12
10886190 Devices and methods for heat dissipation of semiconductor integrated circuits Chung-Chieh Yang, Yung-Chow Peng, Chung-Peng Hsieh 2021-01-05
10758889 Medical macromolecular microsphere adsorbent for a blood perfusion apparatus and a preparation method thereof Li Ren, Yingjun Wang, Lin Wang, Jian Zheng 2020-09-01
10510637 Devices and methods for heat dissipation of semiconductor integrated circuits Chung-Chieh Yang, Yung-Chow Peng, Chung-Peng Hsieh 2019-12-17
10289777 Integrated circuit designs based on temperature distribution determination Szu-Lin Liu, Jaw-Juinn Horng, Fu-Lung Hsueh 2019-05-14
10027304 Dual-band band-pass filters and method of use Ming-Hsien Tsai, Fu-Lung Hsueh, Tzong-Lin Wu, Yang Huang, Chin-Yi Lin 2018-07-17
9899982 On-chip electromagnetic bandgap (EBG) structure for noise suppression Ming-Hsien Tsai, Chien-Min Lin, Fu-Lung Hsueh, Han-Ping Pu, Sen-Kuei Hsu 2018-02-20
9658275 De-embedding on-wafer devices Hsiao-Tsung Yen, Chin-Wei Kuo, Ho-Hsiang Chen, Yu-Ling Lin 2017-05-23
9548267 Three dimensional circuit including shielded inductor and method of forming same Ming-Hsien Tsai, Hsieh-Hung Hsieh, Tzu-Jin Yeh, Chewn-Pu Jou, Fu-Lung Hsueh 2017-01-17
9412721 Contactless communications using ferromagnetic material Ping-Lin Yang, Jun-De Jin, Fu-Lung Hsueh, Tong-Chern Ong, Chun-Jung Lin +1 more 2016-08-09
9355960 Electromagnetic bandgap structure for three dimensional ICS Hsieh-Hung Hsieh, Tzu-Jin Yeh, Tzong-Lin Wu 2016-05-31
9103884 De-embedding on-wafer devices Hsiao-Tsung Yen, Yu-Ling Lin, Chin-Wei Kuo, Ho-Hsiang Chen 2015-08-11
9048127 Three dimensional circuit including shielded inductor and method of forming same Ming-Hsien Tsai, Hsieh-Hung Hsieh, Tzu-Jin Yeh, Chewn-Pu Jou, Fu-Lung Hsueh 2015-06-02
8921160 3D IC configuration with contactless communication Ping-Lin Yang, Chien-Min Lin 2014-12-30
8856710 Tool and method for modeling interposer RC couplings Chao-Yang Yeh, Ze-Ming Wu, Meng-Lin Chung, Chih-Chia Chen, Li Ding 2014-10-07
8760255 Contactless communications using ferromagnetic material Ping-Lin Yang, Jun-De Jin, Fu-Lung Hsueh, Tong-Chern Ong, Chun-Jung Lin +1 more 2014-06-24
8513795 3D IC configuration with contactless communication Ping-Lin Yang, Chien-Min Lin 2013-08-20
6341833 Print control apparatus, printing apparatus, print control method, printing method, recording medium, and method for setting up color conversion table Yuko Yamamoto 2002-01-29
6310637 Method of printing test pattern and printing apparatus for the same Kazumichi Shimada 2001-10-30
6293643 Printing apparatus, printing method, and recording medium Kazumichi Shimada, Shixin Zhou, Yukimitsu Fujimori 2001-09-25