Issued Patents All Time
Showing 1–25 of 208 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424562 | Three-dimensional (3D) package | Wei-Yu Chen, Chun-Chih Chuang, Kuan-Lin Ho, Yu-Min Liang | 2025-09-23 |
| 12417969 | Semiconductor structure and circuit structure | Kuan-Lin Ho, Chin-Liang Chen, Pei-Rong Ni, Chia-Min Lin, Yu-Min Liang | 2025-09-16 |
| 12411279 | Integrated circuit package and method of forming same | Chen-Hua Yu, Szu-Wei Lu | 2025-09-09 |
| 12412862 | Package structure and manufacturing method thereof | Chi-Yang Yu, Nien-Fang Wu, Hai-Ming Chen, Yu-Min Liang | 2025-09-09 |
| 12401012 | Semiconductor device package and methods of manufacture | Chen-Hua Yu | 2025-08-26 |
| 12394732 | Semiconductor package and method | Chen-Hua Yu, Chung-Shi Liu | 2025-08-19 |
| 12368077 | Semiconductor package and method comprising formation of redistribution structure and interconnecting die | Chen-Hua Yu | 2025-07-22 |
| 12368146 | Hybrid integrated circuit packages | Chen-Hua Yu, Hsing-Kuo Hsia | 2025-07-22 |
| 12362228 | Semiconductor package and method | Chen-Hua Yu, Wei-Yu Chen, Chung-Shi Liu, Chien-Hsun Lee | 2025-07-15 |
| 12354969 | Semiconductor device and method of manufacture | Chen-Hua Yu, Chung-Shi Liu, Chien-Hsun Lee | 2025-07-08 |
| 12354924 | Integrated circuit package and method | Chien-Hsun Chen, Yu-Ling Tsai, Chien-Hsun Lee, Chung-Shi Liu | 2025-07-08 |
| 12356558 | Electronic assembly having circuit carrier | Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu | 2025-07-08 |
| 12347802 | Die corner removal for underfill crack suppression in semiconductor die packaging | Wei-Yu Chen, Chi-Yang Yu, Kuan-Lin Ho, Chin-Liang Chen, Yu-Min Liang | 2025-07-01 |
| 12334362 | Package structure including photonic package having embedded optical glue | Chen-Hua Yu | 2025-06-17 |
| 12334446 | Semiconductor package and method | Chen-Hua Yu, Chung-Shi Liu | 2025-06-17 |
| 12308343 | Semiconductor device and method of forming the same | Chen-Hua Yu, Shang-Yun Hou | 2025-05-20 |
| 12300656 | Semiconductor package and method of forming thereof | Chen-Hua Yu | 2025-05-13 |
| 12272631 | Semiconductor package having multiple substrates | Chen-Hua Yu | 2025-04-08 |
| 12272855 | Semiconductor device and methods, where first and second transmission lines are surrounded by first and second high-k dielectric materials | Chien-Hsun Lee, Chewn-Pu Jou, Fu-Lung Hsueh | 2025-04-08 |
| 12249587 | Semiconductor structure and forming method thereof | Chen-Hua Yu, Yu-Min Liang, Jung Wei Cheng | 2025-03-11 |
| 12249564 | Package structure, RDL structure comprising redistribution layer having ground plates and signal lines | Chien-Hsun Chen, Shou-Yi Wang | 2025-03-11 |
| 12249518 | Semiconductor device comprising interconnect structures | Chen-Hua Yu | 2025-03-11 |
| 12243843 | Integrated circuit package and method of forming same | Chen-Hua Yu | 2025-03-04 |
| 12245361 | Interconnect structure having conductor extending along dielectric block | Chien-Hsun Lee, Chewn-Pu Jou, Fu-Lung Hsueh | 2025-03-04 |
| 12243829 | Semiconductor package including cavity-mounted device | Chen-Hua Yu | 2025-03-04 |