Issued Patents All Time
Showing 51–75 of 208 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040281 | Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof | Chuei-Tang Wang, Chen-Hua Yu, Chung-Shi Liu, Chih-Yuan Chang, Jeng-Shien Hsieh +1 more | 2024-07-16 |
| 12038599 | Photonic package and method of manufacture | Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Hung-Yi Kuo, Shang-Yun Hou | 2024-07-16 |
| 12021053 | Semiconductor package and method | Chen-Hua Yu | 2024-06-25 |
| 12002767 | Integrated circuit package and method | Chung-Shi Liu, Chien-Hsun Lee | 2024-06-04 |
| 11984375 | Integrated circuit package and method | Chien-Hsun Chen, Yu-Ling Tsai, Chien-Hsun Lee, Chung-Shi Liu | 2024-05-14 |
| 11984374 | Warpage control of packages using embedded core frame | Chen-Hua Yu, Chung-Shi Liu | 2024-05-14 |
| 11961814 | Integrated circuit package and method | Chien-Hsun Chen, Shou-Yi Wang, Chung-Shi Liu, Chen-Hua Yu | 2024-04-16 |
| 11955442 | Semiconductor package and method | Chen-Hua Yu, Chung-Shi Liu | 2024-04-09 |
| 11935761 | Semiconductor package and method of forming thereof | Chen-Hua Yu | 2024-03-19 |
| 11894318 | Semiconductor device and method of manufacture | Chen-Hua Yu | 2024-02-06 |
| 11894312 | Semiconductor packages and method of manufacture | Wei-Yu Chen, Chun-Chih Chuang, Kuan-Lin Ho, Yu-Min Liang | 2024-02-06 |
| 11854988 | Semiconductor device and method of manufacture | Chen-Hua Yu, Chung-Shi Liu, Chien-Hsun Lee | 2023-12-26 |
| 11855057 | Package structure and method of forming the same | Chi-Yang Yu, Yu-Min Liang, Chien-Hsun Lee | 2023-12-26 |
| 11848304 | Semiconductor device and method of forming the same | Chen-Hua Yu, Shang-Yun Hou | 2023-12-19 |
| 11848234 | Semiconductor package and method comprising formation of redistribution structure and interconnecting die | Chen-Hua Yu | 2023-12-19 |
| 11837567 | Semiconductor package and method of forming thereof | Chen-Hua Yu | 2023-12-05 |
| 11830797 | Semiconductor device and method of manufacture | Chen-Hua Yu | 2023-11-28 |
| 11824032 | Die corner removal for underfill crack suppression in semiconductor die packaging | Wei-Yu Chen, Chi-Yang Yu, Kuan-Lin Ho, Chin-Liang Chen, Yu-Min Liang | 2023-11-21 |
| 11817380 | Semiconductor package and method of forming same | Chen-Hua Yu, Chung-Shi Liu | 2023-11-14 |
| 11817325 | Methods of manufacturing a semiconductor package | Chen-Hua Yu | 2023-11-14 |
| 11810847 | Package structure and method of fabricating the same | Chin-Liang Chen, Kuan-Lin Ho, Pei-Rong Ni, Chia-Min Lin, Yu-Min Liang | 2023-11-07 |
| 11791275 | Semiconductor device and method of manufacturing | Chen-Hua Yu | 2023-10-17 |
| 11784140 | Semiconductor device and method of manufacture | Chen-Hua Yu | 2023-10-10 |
| 11776886 | Symmetrical substrate for semiconductor packaging | Chen-Hua Yu | 2023-10-03 |
| 11756945 | Semiconductor device package and methods of manufacture | Chen-Hua Yu | 2023-09-12 |