Issued Patents All Time
Showing 76–100 of 208 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756945 | Semiconductor device package and methods of manufacture | Chen-Hua Yu | 2023-09-12 |
| 11749594 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Chi-Yang Yu, Yu-Min Liang, Wei-Yu Chen | 2023-09-05 |
| 11737205 | Interconnect structure having conductor extending along dielectric block | Chien-Hsun Lee, Chewn-Pu Jou, Fu-Lung Hsueh | 2023-08-22 |
| 11728217 | Wafer level package structure and method of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Chien-Hsun Lee | 2023-08-15 |
| 11715686 | Semiconductor device and method of manufacture | Chen-Hua Yu, Chien-Hsun Chen | 2023-08-01 |
| 11705408 | Semiconductor package | Chi-Yang Yu, Jung Wei Cheng, Yu-Min Liang, Yen-Fu Su, Chien-Chang Lin +1 more | 2023-07-18 |
| 11705378 | Semiconductor packages and methods of forming the same | Jung Wei Cheng, Hsin-Yu Pan, Tsung-Ding Wang, Yu-Min Liang, Wei-Yu Chen | 2023-07-18 |
| 11699691 | Interposer frame and method of manufacturing the same | — | 2023-07-11 |
| 11688693 | Semiconductor packages and method of manufacture | Wei-Yu Chen, Chun-Chih Chuang, Kuan-Lin Ho, Yu-Min Liang | 2023-06-27 |
| 11670575 | Package structure, RDL structure comprising redistribution layer having ground plates and signal lines | Chien-Hsun Chen, Shou-Yi Wang | 2023-06-06 |
| 11665834 | Electronic assembly having circuit carrier and manufacturing method thereof | Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu | 2023-05-30 |
| 11664566 | Semiconductor device and method, where a dielectric material directly contacts a high-k dielectric material and first and second transmission lines | Chien-Hsun Lee, Chewn-Pu Jou, Fu-Lung Hsueh | 2023-05-30 |
| 11664350 | Semiconductor device and method of manufacture | Chen-Hua Yu, Chung-Shi Liu | 2023-05-30 |
| 11658164 | Electronics card including multi-chip module | Chen-Hua Yu, Chien-Hsun Lee | 2023-05-23 |
| 11658085 | Integrated circuit package and method | Chien-Hsun Chen, Yu-Ling Tsai, Chien-Hsun Lee, Chung-Shi Liu | 2023-05-23 |
| 11658134 | Inductor structure, semiconductor package and fabrication method thereof | Chih-Yuan Chang, Chien-Hsun Lee, Chung-Shi Liu, Chen-Hua Yu | 2023-05-23 |
| 11616026 | Semiconductor device and method of manufacture | Chen-Hua Yu | 2023-03-28 |
| 11605621 | Hybrid integrated circuit package and method | Chen-Hua Yu, Hsing-Kuo Hsia | 2023-03-14 |
| 11602056 | Circuit board and semiconductor device including the same | Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu | 2023-03-07 |
| 11594479 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Pei-Rong Ni, Chia-Min Lin, Yu-Min Liang | 2023-02-28 |
| 11594498 | Semiconductor package and method | Chen-Hua Yu, Chung-Shi Liu | 2023-02-28 |
| 11532587 | Method for manufacturing semiconductor package with connection structures including via groups | Chien-Hsun Chen, Chien-Hsun Lee, Chung-Shi Liu | 2022-12-20 |
| 11532582 | Semiconductor device package and method of manufacture | Chen-Hua Yu | 2022-12-20 |
| 11515173 | Semiconductor devices and methods of manufacturing | Chien-Hsun Chen, Yu-Min Liang, Yen-Ping Wang, Chen-Hua Yu, Kai-Chiang Wu | 2022-11-29 |
| 11488881 | Semiconductor device and method of manufacture | Chen-Hua Yu, Chien-Hsun Lee | 2022-11-01 |