Issued Patents All Time
Showing 126–150 of 208 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094634 | Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof | Chuei-Tang Wang, Chen-Hua Yu, Chung-Shi Liu, Chih-Yuan Chang, Jeng-Shien Hsieh +1 more | 2021-08-17 |
| 11088059 | Package structure, RDL structure comprising redistribution layer having ground plates and signal lines and method of forming the same | Chien-Hsun Chen, Shou-Yi Wang | 2021-08-10 |
| 11069573 | Wafer level package structure and method of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Chien-Hsun Lee | 2021-07-20 |
| 11049802 | Semiconductor device and method of manufacture | Chen-Hua Yu | 2021-06-29 |
| 11006532 | Circuit carrier and manifacturing method thereof | Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu | 2021-05-11 |
| 10971446 | Semiconductor device and method of manufacture | Chen-Hua Yu, Chien-Hsun Chen | 2021-04-06 |
| 10937736 | Hybrid integrated circuit package and method | Chen-Hua Yu, Hsing-Kuo Hsia | 2021-03-02 |
| 10937721 | Semiconductor structure | Chen-Hua Yu, Chung-Shi Liu, Chien-Hsun Lee | 2021-03-02 |
| 10916529 | Electronics card including multi-chip module | Chen-Hua Yu, Chien-Hsun Lee | 2021-02-09 |
| 10916519 | Method for manufacturing semiconductor package with connection structures including via groups | Chien-Hsun Chen, Chien-Hsun Lee, Chung-Shi Liu | 2021-02-09 |
| 10888000 | Manufacturing method of circuit board and of semiconductor device including the same | Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu | 2021-01-05 |
| 10869385 | Semiconductor device, circuit board structure and method of fabricating the same | Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu | 2020-12-15 |
| 10867982 | Hybrid integrated circuit package and method | Chen-Hua Yu, Hsing-Kuo Hsia | 2020-12-15 |
| 10867947 | Semiconductor packages and methods of manufacturing the same | Chen-Hua Yu, Yu-Min Liang | 2020-12-15 |
| 10861836 | Interposer frame and method of manufacturing the same | — | 2020-12-08 |
| 10854552 | Semiconductor device and method of manufacture | Chen-Hua Yu, Chung-Shi Liu, Chien-Hsun Lee | 2020-12-01 |
| 10840224 | Interposer frame and method of manufacturing the same | — | 2020-11-17 |
| 10804192 | Protrusion bump pads for bond-on-trace processing | Yu-Min Liang | 2020-10-13 |
| 10785865 | Interconnect structure and method of manufacturing the same | Chien-Hsun Lee, Chewn-Pu Jou, Fu-Lung Hsueh | 2020-09-22 |
| 10772205 | Circuit board, semiconductor device including the same, and manufacturing method thereof | Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu | 2020-09-08 |
| 10700034 | Protrusion bump pads for bond-on-trace processing | Yu-Min Liang | 2020-06-30 |
| 10672751 | Contoured package-on-package joint | — | 2020-06-02 |
| 10665520 | Integrated circuit package and method | Chien-Hsun Chen, Yu-Ling Tsai, Chien-Hsun Lee, Chung-Shi Liu | 2020-05-26 |
| 10638616 | Circuit carrier and manifacturing method thereof | Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu | 2020-04-28 |
| 10629579 | Package-on-package with cavity in interposer | — | 2020-04-21 |