Issued Patents All Time
Showing 151–175 of 208 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10555424 | Circuit board, semiconductor device including the same, and manufacturing method thereof | Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu | 2020-02-04 |
| 10530030 | Semiconductor device having first and second transmission lines with a high-K dielectric material disposed between the first and second transmission lines | Chien-Hsun Lee, Chewn-Pu Jou, Fu-Lung Hsueh | 2020-01-07 |
| 10522495 | Protrusion bump pads for bond-on-trace processing | Yu-Min Liang | 2019-12-31 |
| 10461022 | Semiconductor package structure and manufacturing method thereof | Chen-Hua Yu, Chung-Shi Liu, Chien-Hsun Lee | 2019-10-29 |
| 10354983 | Integrated circuit package and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Chien-Hsun Lee | 2019-07-16 |
| 10319655 | POP structures with dams encircling air gaps and methods for forming the same | Chen-Hua Yu, Tsung-Ding Wang, Chen-Shien Chen, Chung-Shi Liu | 2019-06-11 |
| 10319607 | Package-on-package structure with organic interposer | Yu-Min Liang, Mirng-Ji Lii, Chien-Hsun Lee, Tsung-Ding Wang, Jung Wei Cheng | 2019-06-11 |
| 10163774 | Protrusion bump pads for bond-on-trace processing | Yu-Min Liang | 2018-12-25 |
| 10163768 | Semiconductor structure and method of manufacturing the same | Yu-Min Liang | 2018-12-25 |
| 10020286 | Package on package devices and methods of packaging semiconductor dies | Yung Ching Chen, Chien-Hsun Lee, Chen-Hua Yu, Ming-Da Cheng, Mirng-Ji Lii | 2018-07-10 |
| 10014270 | Protrusion bump pads for bond-on-trace processing | Yu-Min Liang | 2018-07-03 |
| 9991246 | Contoured package-on-package joint | — | 2018-06-05 |
| 9985013 | Package-on-package structure and methods for forming the same | Chien-Hsun Lee, Jung Wei Cheng, Hao-Cheng Hou, Tsung-Ding Wang, Ming-Chung Sung | 2018-05-29 |
| 9935038 | Semiconductor device packages and methods | Tsung-Ding Wang, Hung-Jen Lin, Mirng-Ji Lii, Chien-Hsun Lee | 2018-04-03 |
| 9870946 | Wafer level package structure and method of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Chien-Hsun Lee | 2018-01-16 |
| 9865580 | Package on-package with cavity in interposer | — | 2018-01-09 |
| 9847320 | Semiconductor structure and method of fabricating the same | Chien-Hsun Chen, William Wu Shen, Chien-Hsun Lee | 2017-12-19 |
| 9831207 | No-flow underfill for package with interposer frame | — | 2017-11-28 |
| 9812416 | Semiconductor arrangement and formation thereof | Hsueh-Lung Cheng, Shou-Yi Wang | 2017-11-07 |
| 9807867 | Interconnect structure and method of manufacturing the same | Chien-Hsun Lee, Chewn-Pu Jou, Fu-Lung Hsueh | 2017-10-31 |
| 9786976 | Transmission line design and method, where high-k dielectric surrounds the transmission line for increased isolation | Chien-Hsun Lee, Chewn-Pu Jou, Fu-Lung Hsueh | 2017-10-10 |
| 9768105 | Rigid interconnect structures in package-on-package assemblies | Mirng-Ji Lii, Chen-Hua Yu, Chien-Hsiun Lee, Yung Ching Chen | 2017-09-19 |
| 9768090 | Substrate design for semiconductor packages and method of forming same | Yu-Min Liang, Mirng-Ji Lii | 2017-09-19 |
| 9691636 | Interposer frame and method of manufacturing the same | — | 2017-06-27 |
| 9659881 | Semiconductor structure including a substrate and a semiconductor chip with matching coefficients of thermal expansion | Yu-Min Liang | 2017-05-23 |