Issued Patents All Time
Showing 101–125 of 208 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482484 | Symmetrical substrate for semiconductor packaging | Chen-Hua Yu | 2022-10-25 |
| 11457525 | Interconnect structure having conductor extending along dielectric block | Chien-Hsun Lee, Chewn-Pu Jou, Fu-Lung Hsueh | 2022-09-27 |
| 11410968 | Semiconductor device and method of forming the same | Chen-Hua Yu, Shang-Yun Hou | 2022-08-09 |
| 11398422 | Package structure and fabricating method thereof | Chun-Lin Lu, Kai-Chiang Wu | 2022-07-26 |
| 11380620 | Semiconductor package including cavity-mounted device | Chen-Hua Yu | 2022-07-05 |
| 11355463 | Semiconductor package and method | Chen-Hua Yu | 2022-06-07 |
| 11355428 | Semiconductor package | Chen-Hua Yu, Chung-Shi Liu | 2022-06-07 |
| 11348874 | Semiconductor packages and forming methods thereof | Kai-Chiang Wu, Chin-Liang Chen, Yen-Ping Wang | 2022-05-31 |
| 11315862 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Chi-Yang Yu, Yu-Min Liang, Wei-Yu Chen | 2022-04-26 |
| 11282761 | Semiconductor packages and methods of manufacturing the same | Chen-Hua Yu, Chung-Shi Liu, Yu-Min Liang | 2022-03-22 |
| 11282779 | Package structure and fabricating method thereof | Kai-Chiang Wu, Yu-Min Liang | 2022-03-22 |
| 11270990 | Contoured package-on-package joint | — | 2022-03-08 |
| 11258151 | Semiconductor device having a high-k dielectric material disposed beyween first and second transmission lines and a dielectric directly contacting the high-k dielectric material | Chien-Hsun Lee, Chewn-Pu Jou, Fu-Lung Hsueh | 2022-02-22 |
| 11251099 | Warpage control of packages using embedded core frame | Chen-Hua Yu, Chung-Shi Liu | 2022-02-15 |
| 11239193 | Integrated circuit package and method | Chien-Hsun Chen, Shou-Yi Wang, Chung-Shi Liu, Chen-Hua Yu | 2022-02-01 |
| 11217538 | Integrated circuit package and method | Chung-Shi Liu, Chien-Hsun Lee | 2022-01-04 |
| 11217497 | Integrated circuit package and method | Chien-Hsun Chen, Yu-Ling Tsai, Chien-Hsun Lee, Chung-Shi Liu | 2022-01-04 |
| 11217546 | Embedded voltage regulator structure and method forming same | Chen-Hua Yu, Chien-Hsun Chen | 2022-01-04 |
| 11195788 | Hybrid dielectric scheme in packages | Chien-Hsun Chen, Chen-Hua Yu | 2021-12-07 |
| 11177218 | Package including metallic bolstering pattern and manufacturing method of the package | Chien-Hsun Lee, Shou-Yi Wang, Chien-Hsun Chen | 2021-11-16 |
| 11171090 | Semiconductor device and method of manufacture | Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Shou-Yi Wang, Chien-Hsun Chen | 2021-11-09 |
| 11152344 | Integrated circuit package and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Chien-Hsun Lee | 2021-10-19 |
| 11145614 | Semiconductor device and method of manufacture | Chen-Hua Yu, Chung-Shi Liu | 2021-10-12 |
| 11133283 | Integrated fan-out device | Chen-Hua Yu, Chung-Shi Liu | 2021-09-28 |
| 11101209 | Redistribution structures in semiconductor packages and methods of forming same | Chung-Shi Liu, Chien-Hsun Lee, Hao-Cheng Hou, Hung-Jen Lin, Jung Wei Cheng +3 more | 2021-08-24 |