Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417968 | Package structure and forming method thereof | Chin-Liang Chen, Chi-Yang Yu, Yu-Min Liang, Jung Wei Cheng, Tsung-Ding Wang | 2025-09-16 |
| 12418982 | Laminated structure with pads and manufacturing method thereof | Tsung-Ding Wang, Jung Wei Cheng, Chien-Hsun Chen, Chien-Hsun Lee | 2025-09-16 |
| 12412846 | Semiconductor package and methods of fabricating a semiconductor package | Chin-Liang Chen, Yu-Min Liang, Jung Wei Cheng, Tsung-Ding Wang | 2025-09-09 |
| 12362321 | Semiconductor package | Tsung-Ding Wang, Yen-Fu Su, Jung Wei Cheng, Chien-Hsun Lee, Hsin-Yu Pan | 2025-07-15 |
| 12345740 | Probe card substrate, substrate structure and method of fabricating the same | Wei-Yu Chen, Yu-Min Liang, Tsung-Ding Wang, Chien-Hsun Lee, Chung-Shi Liu +1 more | 2025-07-01 |
| 12142560 | Semiconductor packages and methods of forming same | Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hung-Jen Lin, Jung Wei Cheng +3 more | 2024-11-12 |
| 11961777 | Package structure comprising buffer layer for reducing thermal stress and method of forming the same | Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hung-Jui Kuo, Jung Wei Cheng +3 more | 2024-04-16 |
| 11894341 | Semiconductor package with through vias and stacked redistribution layers and manufacturing method thereof | Tsung-Ding Wang, Yen-Fu Su, Jung Wei Cheng, Chien-Hsun Lee, Hsin-Yu Pan | 2024-02-06 |
| 11538761 | Semiconductor package having molded die and semiconductor die and manufacturing method thereof | Wei-Yu Chen, Jung Wei Cheng, Tsung-Ding Wang, Chien-Hsun Lee, Chung-Shi Liu | 2022-12-27 |
| 11499080 | Thermal interface material, and preparation and application thereof | Wen Dai, Zhengde Lin, Nan Jiang, Jinhong Yu, Dan Dai | 2022-11-15 |
| 11466805 | Intelligent plugging robot and method for long-distance pipeline rerouting, maintaining and repairing construction | Yang Tang, Yuan Wang, Haoyu Xiong, Jinzhong Wang, Mingbo Wang +8 more | 2022-10-11 |
| 11424199 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Chien-Hsun Lee, Hung-Jen Lin, Chun-Chih Chuang +2 more | 2022-08-23 |
| 11404342 | Package structure comprising buffer layer for reducing thermal stress and method of forming the same | Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hung-Jui Kuo, Jung Wei Cheng +3 more | 2022-08-02 |
| 11270921 | Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereof | Chien-Hsun Lee, Chung-Shi Liu, Jung Wei Cheng, Tsung-Ding Wang, Yi-Yang Lei | 2022-03-08 |
| 11145639 | Semiconductor package and manufacturing method thereof | Jung Wei Cheng, Chien-Hsun Lee, Chi-Yang Yu, Hsin-Yu Pan, Tsung-Ding Wang | 2021-10-12 |
| 11101209 | Redistribution structures in semiconductor packages and methods of forming same | Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hung-Jen Lin, Jung Wei Cheng +3 more | 2021-08-24 |
| 11088069 | Semiconductor package and semiconductor device | Chien-Hsun Lee, Chung-Shi Liu, Jung Wei Cheng, Tsung-Ding Wang | 2021-08-10 |
| 10818614 | Package structure | Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Jung Wei Cheng | 2020-10-27 |
| 10522486 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Chien-Hsun Lee, Hung-Jen Lin, Chun-Chih Chuang +2 more | 2019-12-31 |
| 10504858 | Package structure and method of fabricating the same | Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Jung Wei Cheng | 2019-12-10 |
| 10128208 | Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices | Yu-Feng Chen, Jung Wei Cheng, Yu-Min Liang, Tsung-Ding Wang | 2018-11-13 |
| 10074604 | Integrated fan-out package and method of fabricating the same | Chien-Hsun Lee, Hung-Jen Lin, Jung Wei Cheng, Tsung-Ding Wang | 2018-09-11 |
| 10026671 | Substrate design for semiconductor packages and method of forming same | Chen-Hua Yu, Mirng-Ji Lii, Chien-Hsun Lee, Tsung-Ding Wang, Jung Wei Cheng +2 more | 2018-07-17 |
| 9985013 | Package-on-package structure and methods for forming the same | Chien-Hsun Lee, Jung Wei Cheng, Tsung-Ding Wang, Jiun Yi Wu, Ming-Chung Sung | 2018-05-29 |
| 9929115 | Device with optimized thermal characteristics | Jung Wei Cheng, Tsung-Ding Wang, Ming-Che Liu | 2018-03-27 |