Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9985013 | Package-on-package structure and methods for forming the same | Chien-Hsun Lee, Jung Wei Cheng, Hao-Cheng Hou, Tsung-Ding Wang, Jiun Yi Wu | 2018-05-29 |
| 9165876 | Package-on-package structure and methods for forming the same | Chien-Hsun Lee, Jung Wei Cheng, Hao-Cheng Hou, Tsung-Ding Wang, Jiun Yi Wu | 2015-10-20 |
| 9147584 | Rotating curing | Jing Ruei Lu, Yu-Chih Liu, Wei-Ting Lin, Chien-Kuo Chang | 2015-09-29 |
| 8927877 | Looped interconnect structure | Hsin-An Shen, Yung Ching Chen, Chih-Hang Tung, Chien-Hsun Lee, Da-Yuan Shih | 2015-01-06 |
| 8823180 | Package on package devices and methods of packaging semiconductor dies | Tsung-Ding Wang, Jiun Yi Wu, Chien-Hsiun Lee, Mirng-Ji Lii | 2014-09-02 |
| 8796132 | System and method for forming uniform rigid interconnect structures | Yung Ching Chen, Chien-Hsun Lee, Chen-Hua Yu, Mirng-Ji Lii | 2014-08-05 |
| 8664039 | Methods and apparatus for alignment in flip chip bonding | Yu-Chih Liu, Wei-Ting Lin, Chien-Hsiun Lee | 2014-03-04 |
| 8652939 | Method and apparatus for die assembly | Yu-Chih Liu, Wei-Ting Lin, Chien-Hsiun Lee | 2014-02-18 |
| 8232183 | Process and apparatus for wafer-level flip-chip assembly | Chien-Hsiun Lee, Clinton Chao, Tjandra Winata Karta | 2012-07-31 |
| 7977155 | Wafer-level flip-chip assembly methods | Chien-Hsiun Lee, Clinton Chao, Tjandra Winata Karta | 2011-07-12 |
| 7951647 | Performing die-to-wafer stacking by filling gaps between dies | Ku-Feng Yang, Wen-Chih Chiou, Weng-Jin Wu | 2011-05-31 |
| 7642631 | Packaged semiconductor chip comprising an integrated circuit chip ablated with laser and cut with saw blade from wafer | Szu-Wei Lu, Hsin-Hui Lee, Mirng-Ji Lii | 2010-01-05 |
| 7265034 | Method of cutting integrated circuit chips from wafer by ablating with laser and cutting with saw blade | Szu-Wei Lu, Hsin-Hui Lee, Mirng-Ji Lii | 2007-09-04 |