Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142560 | Semiconductor packages and methods of forming same | Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Jung Wei Cheng +3 more | 2024-11-12 |
| 11857282 | Multi-segment rotation robotic arm | Han-I Huang | 2024-01-02 |
| 11424199 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Chien-Hsun Lee, Hao-Cheng Hou, Chun-Chih Chuang +2 more | 2022-08-23 |
| 11394837 | System and method using matrix barcode information to process documents | Chun-Cheih Liao, Chun-Ping Huang | 2022-07-19 |
| 11101209 | Redistribution structures in semiconductor packages and methods of forming same | Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Jung Wei Cheng +3 more | 2021-08-24 |
| 10896220 | Method of searching an image file in a computer system, related image file searching device, and related computer system | Chun-Chieh Liao, Chun-Ping Huang | 2021-01-19 |
| 10867957 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2020-12-15 |
| 10777431 | Post-passivation interconnect structure and method of forming the same | Tsung-Ding Wang, Chien-Hsiun Lee | 2020-09-15 |
| 10728419 | System and method using matrix barcode information to perform point-to-point information exchange | Chun-Cheih Liao, Chun-Ping Huang | 2020-07-28 |
| 10665565 | Package assembly | Tsung-Ding Wang, Chien-Hsiun Lee, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2020-05-26 |
| 10651055 | Post-passivation interconnect structure and method of forming the same | Tsung-Ding Wang, Chien-Hsun Lee | 2020-05-12 |
| 10522486 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Chien-Hsun Lee, Hao-Cheng Hou, Chun-Chih Chuang +2 more | 2019-12-31 |
| 10483132 | Post-passivation interconnect structure and method of forming the same | Tsung-Ding Wang, Chien-Hsun Lee | 2019-11-19 |
| 10192848 | Package assembly | Tsung-Ding Wang, Chien-Hsiun Lee, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2019-01-29 |
| 10163846 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2018-12-25 |
| 10074604 | Integrated fan-out package and method of fabricating the same | Hao-Cheng Hou, Chien-Hsun Lee, Jung Wei Cheng, Tsung-Ding Wang | 2018-09-11 |
| 10026671 | Substrate design for semiconductor packages and method of forming same | Chen-Hua Yu, Mirng-Ji Lii, Chien-Hsun Lee, Tsung-Ding Wang, Jung Wei Cheng +2 more | 2018-07-17 |
| 9935038 | Semiconductor device packages and methods | Tsung-Ding Wang, Jiun Yi Wu, Mirng-Ji Lii, Chien-Hsun Lee | 2018-04-03 |
| 9859267 | Package structures and methods of forming the same | Hao-Cheng Hou, Ming-Che Liu, Chun-Chih Chuang, Jung Wei Cheng, Tsung-Ding Wang | 2018-01-02 |
| 9780064 | Method of forming package assembly | Tsung-Ding Wang, Chien-Hsiun Lee, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2017-10-03 |
| 9691723 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Chien-Hsun Lee, Hao-Cheng Hou, Chun-Chih Chuang +2 more | 2017-06-27 |
| 9673158 | Formation of connectors without UBM | Tsung-Ding Wang, Chien-Hsun Lee | 2017-06-06 |
| 9564416 | Package structures and methods of forming the same | Hao-Cheng Hou, Ming-Che Liu, Chun-Chih Chuang, Jung Wei Cheng, Tsung-Ding Wang | 2017-02-07 |
| 9559071 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2017-01-31 |
| 9396973 | Methods and apparatus for wafer level packaging | Tsung-Yuan Yu, Hsien-Wei Chen, Wen-Hsiung Lu | 2016-07-19 |