HL

Hung-Jen Lin

TSMC: 27 patents #1,273 of 12,232Top 15%
AV Avision: 3 patents #38 of 148Top 30%
AM AMD: 2 patents #3,994 of 9,279Top 45%
SL Spansion Llc.: 1 patents #435 of 769Top 60%
📍 Tainan, CA: #22 of 115 inventorsTop 20%
Overall (All Time): #101,461 of 4,157,543Top 3%
34
Patents All Time

Issued Patents All Time

Showing 26–34 of 34 patents

Patent #TitleCo-InventorsDate
9059109 Package assembly and method of forming the same Tsung-Ding Wang, Chien-Hsiun Lee, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu 2015-06-16
8987922 Methods and apparatus for wafer level packaging Tsung-Yuan Yu, Hsien-Wei Chen, Wen-Hsiung Lu 2015-03-24
8987605 Formation of connectors without UBM Tsung-Ding Wang, Chien-Hsiun Lee 2015-03-24
7679972 High reliable and low power static random access memory Jinsook Kim, Nian Yang, Sachit Chandra 2010-03-16
7176081 Low temperature method for metal deposition Chih-Fu Chang, Yen-Hsiu Chen, Ming-Chu King, Ching-Hwanq Su, Chih-Mu Huang +1 more 2007-02-13
6949471 Method for fabricating poly patterns Ching-Chen Hao, Min-hwa Chi, Chih-Heng Shen 2005-09-27
6777708 Apparatus and methods for determining floating body effects in SOI devices W. Eugene Hill 2004-08-17
6774395 Apparatus and methods for characterizing floating body effects in SOI devices W Eugene Hill, Mario M. Pelella, Chern-Jann Lee, Srikanth Sundararajan, Siu May Ho 2004-08-10
6638409 Stable plating performance in copper electrochemical plating Chen-Ming Huang, Li-Chuen Cheng, Chih-Chen Ku, San-Sun Yang 2003-10-28