Issued Patents All Time
Showing 176–200 of 208 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659918 | POP structures with dams encircling air gaps and methods for forming the same | Chen-Hua Yu, Dean Wang, Chen-Shien Chen, Chung-Shi Liu | 2017-05-23 |
| 9653442 | Integrated circuit package and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Chien-Hsun Lee | 2017-05-16 |
| 9646922 | Methods and apparatus for thinner package on package structures | — | 2017-05-09 |
| 9646928 | Semiconductor arrangement and formation thereof | Hsueh-Lung Cheng, Shou-Yi Wang | 2017-05-09 |
| 9607936 | Copper bump joint structures with improved crack resistance | Ching-Wen Hsiao, Ru-Ying Huang, Chen-Shien Chen | 2017-03-28 |
| 9589924 | Semiconductor structure and method of manufacturing the same | Yu-Min Liang | 2017-03-07 |
| 9583474 | Package on packaging structure and methods of making same | Wen-Yi Lin, Jing Ruei Lu, Po-Yao Lin, Ming-Chih Yew | 2017-02-28 |
| 9460977 | Package-on-Package with via on pad connections | — | 2016-10-04 |
| 9418928 | Protrusion bump pads for bond-on-trace processing | Yu-Min Liang | 2016-08-16 |
| 9385097 | Bump-on-trace methods and structures in packaging | — | 2016-07-05 |
| 9337135 | Pop joint through interposer | Mirng-Ji Lii, Chien-Hsun Lee, Yu-Min Liang | 2016-05-10 |
| 9287245 | Contoured package-on-package joint | — | 2016-03-15 |
| 9275964 | Substrate contact opening | Chen-Hua Yu | 2016-03-01 |
| 9275967 | Protrusion bump pads for bond-on-trace processing | Yu-Min Liang | 2016-03-01 |
| 9263377 | POP structures with dams encircling air gaps and methods for forming the same | Chen-Hua Yu, Tsung-Ding Wang, Chen-Shien Chen, Chung-Shi Liu | 2016-02-16 |
| 9214450 | Package-on-package with via on pad connections | — | 2015-12-15 |
| 9171790 | Package on package devices and methods of packaging semiconductor dies | Chen-Hua Yu, Yung Ching Chen, Chien-Hsun Lee, Mirng-Ji Lii, Ming-Da Cheng | 2015-10-27 |
| 9165876 | Package-on-package structure and methods for forming the same | Chien-Hsun Lee, Jung Wei Cheng, Hao-Cheng Hou, Tsung-Ding Wang, Ming-Chung Sung | 2015-10-20 |
| 9111930 | Package on-package with cavity in interposer | — | 2015-08-18 |
| 9082765 | Bump-on-trace (BOT) structures and methods for forming the same | Chen-Hua Yu, Chien-Hsun Lee | 2015-07-14 |
| 9006033 | Method of making package with interposer frame | — | 2015-04-14 |
| 8970033 | Extending metal traces in bump-on-trace structures | Yu-Feng Chen, Yuh Chern Shieh, Tsung-Shu Lin, Han-Ping Pu, Tin-Hao Kuo | 2015-03-03 |
| 8945984 | Bump-on-trace methods and structures in packaging | — | 2015-02-03 |
| 8946072 | No-flow underfill for package with interposer frame | — | 2015-02-03 |
| 8946888 | Package on packaging structure and methods of making same | Wen-Yi Lin, Ming-Chih Yew, Po-Yao Lin, Jing Ruei Lu | 2015-02-03 |