Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157831 | Semiconductor device having a conductive via structure | Kuo-Chin Chang | 2018-12-18 |
| 9514978 | Method of forming semiconductor device having a conductive via structure | Kuo-Chin Chang | 2016-12-06 |
| 9406634 | Package structure and method of forming the same | Han-Ping Pu, Yu-Feng Chen, Tin-Hao Kuo | 2016-08-02 |
| 9159638 | Conductive via structure | Kuo-Chin Chang | 2015-10-13 |
| 9041223 | Bump-on-trace (BOT) structures | Han-Ping Pu, Yu-Feng Chen, Tin-Hao Kuo | 2015-05-26 |
| 8970033 | Extending metal traces in bump-on-trace structures | Yu-Feng Chen, Tsung-Shu Lin, Han-Ping Pu, Jiun Yi Wu, Tin-Hao Kuo | 2015-03-03 |
| 8519535 | Method and structure for controlling package warpage | Tsung-Shu Lin, Kuo-Chin Chang | 2013-08-27 |
| 8288871 | Reduced-stress bump-on-trace (BOT) structures | Han-Ping Pu, Yu-Feng Chen, Tin-Hao Kuo | 2012-10-16 |