Issued Patents All Time
Showing 201–208 of 208 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8847369 | Packaging structures and methods for semiconductor devices | Ming-Chih Yew, Wen-Yi Lin, Po-Yao Lin | 2014-09-30 |
| 8823180 | Package on package devices and methods of packaging semiconductor dies | Tsung-Ding Wang, Ming-Chung Sung, Chien-Hsiun Lee, Mirng-Ji Lii | 2014-09-02 |
| 8803323 | Package structures and methods for forming the same | Chen-Hua Yu, Tsung-Ding Wang | 2014-08-12 |
| 8766460 | Package with interposer frame and method of making the same | — | 2014-07-01 |
| 8698306 | Substrate contact opening | Chen-Hua Yu | 2014-04-15 |
| 8670637 | Optical clock signal distribution using through-silicon vias | Shih-Cheng Chang, Jin-Lien Lin, Kuo-Ching Hsu, Kai-Ming Ching, Yen-Huei Chen | 2014-03-11 |
| 8642393 | Package on package devices and methods of forming same | Chen-Hua Yu, Mirng-Ji Lii, Chien-Hsun Lee, Yung Ching Chen | 2014-02-04 |
| 8005326 | Optical clock signal distribution using through-silicon vias | Shih-Cheng Chang, Jin-Lien Lin, Kuo-Ching Hsu, Kai-Ming Ching, Yen-Huei Chen | 2011-08-23 |