Issued Patents All Time
Showing 1–25 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021042 | Semiconductor package and method of manufacturing the same | Shu-Shen Yeh, Chien-Hung Chen, Hui Yu, Yu-Min Cheng | 2024-06-25 |
| 11637072 | Semiconductor package and method of manufacturing the same | Shu-Shen Yeh, Chien-Hung Chen, Hui Yu, Yu-Min Cheng | 2023-04-25 |
| 9859252 | Cooling channels in 3DIC stacks | Ching-Wen Hsiao, Tsung-Ding Wang, Ming Hung Tseng, Chen-Shien Chen | 2018-01-02 |
| 9673174 | Through silicon via bonding structure | Tsung-Ding Wang, Chen-Shien Chen, Bo-I Lee, Chien-Hsun Lee | 2017-06-06 |
| 9355933 | Cooling channels in 3DIC stacks | Ching-Wen Hsiao, Tsung-Ding Wang, Ming Hung Tseng, Chen-Shien Chen | 2016-05-31 |
| 9236359 | System and method for 3D integrated circuit stacking | — | 2016-01-12 |
| 9006892 | System and method for 3D integrated circuit stacking | — | 2015-04-14 |
| 8932906 | Through silicon via bonding structure | Dean Wang, Chen-Shien Chen, Bo-I Lee, Chien-Hsiun Lee | 2015-01-13 |
| 8703609 | Through-substrate via for semiconductor device | Chen-Cheng Kuo, Chen Chen-Shien, Chih-Hua Chen | 2014-04-22 |
| 8670637 | Optical clock signal distribution using through-silicon vias | Shih-Cheng Chang, Jin-Lien Lin, Kuo-Ching Hsu, Jiun Yi Wu, Yen-Huei Chen | 2014-03-11 |
| 8624360 | Cooling channels in 3DIC stacks | Ching-Wen Hsiao, Tsung-Ding Wang, Ming-Hong Tseng, Chen-Shien Chen | 2014-01-07 |
| 8497584 | Method to improve bump reliability for flip chip device | Yen-Ming Chen, Chia-Fu Lin, Shun-Liang Hsu, Hsin-Hui Lee, Chao-Yuan Su +1 more | 2013-07-30 |
| 8476769 | Through-silicon vias and methods for forming the same | Chih-Hua Chen, Chen-Shien Chen, Chen-Cheng Kuo, Kuo-Ching Hsu | 2013-07-02 |
| 8456008 | Structure and process for the formation of TSVs | Chen-Cheng Kuo, Chen Chen-Shien | 2013-06-04 |
| 8426256 | Method of forming stacked-die packages | C. W. Hsiao, Bo-I Lee, Tsung-Ding Wang, Chen-Shien Chen, Chien-Hsiun Lee +1 more | 2013-04-23 |
| 8309396 | System and method for 3D integrated circuit stacking | — | 2012-11-13 |
| 8097953 | Three-dimensional integrated circuit stacking-joint interface structure | Ming-Hong Tseng, Chen-Shien Chen, Ching-Wen Hsiao, Hon-Lin Huang, Tsung-Ding Wang | 2012-01-17 |
| 8034708 | Structure and process for the formation of TSVs | Chen-Cheng Kuo, Chen-Shien Chen | 2011-10-11 |
| 8005326 | Optical clock signal distribution using through-silicon vias | Shih-Cheng Chang, Jin-Lien Lin, Kuo-Ching Hsu, Jiun Yi Wu, Yen-Huei Chen | 2011-08-23 |
| 7973413 | Through-substrate via for semiconductor device | Chen-Cheng Kuo, Chen Chen-Shien, Chih-Hua Chen | 2011-07-05 |
| 7906425 | Fluxless bumping process | Chao-Yuan Su, Chia-Fu Lin, Hsin-Hui Lee, Yen-Ming Chen, Li-Chih Chen +2 more | 2011-03-15 |
| 7888236 | Semiconductor device and fabrication methods thereof | Han-Ping Pu, Bai-Yao Lou, Dean Wang, Ching-Wen Hsiao, Chen-Cheng Kuo +3 more | 2011-02-15 |
| 7843064 | Structure and process for the formation of TSVs | Chen-Cheng Kuo, Chen Chen-Shien | 2010-11-30 |
| 7816227 | Tapered through-silicon via structure | Chen-Shien Chen, Chen-Cheng Kuo, Chih-Hua Chen | 2010-10-19 |
| 7785927 | Multi-die wafer level packaging | Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo | 2010-08-31 |