Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8624360 | Cooling channels in 3DIC stacks | Kai-Ming Ching, Ching-Wen Hsiao, Tsung-Ding Wang, Chen-Shien Chen | 2014-01-07 |
| 8390125 | Through-silicon via formed with a post passivation interconnect structure | Sheng Huang Jao | 2013-03-05 |
| 8097953 | Three-dimensional integrated circuit stacking-joint interface structure | Kai-Ming Ching, Chen-Shien Chen, Ching-Wen Hsiao, Hon-Lin Huang, Tsung-Ding Wang | 2012-01-17 |
| 7932608 | Through-silicon via formed with a post passivation interconnect structure | Sheng Huang Jao | 2011-04-26 |