Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8390125 | Through-silicon via formed with a post passivation interconnect structure | Ming-Hong Tseng | 2013-03-05 |
| 7932608 | Through-silicon via formed with a post passivation interconnect structure | Ming-Hong Tseng | 2011-04-26 |