Issued Patents All Time
Showing 1–25 of 97 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218001 | Semiconductor package and method of fabricating semiconductor package | Zi-Jheng Liu, Hung-Jui Kuo | 2025-02-04 |
| 12125741 | Semiconductor package and method of fabricating semiconductor package | Zi-Jheng Liu, Hung-Jui Kuo | 2024-10-22 |
| 12113055 | Stress reduction apparatus and method | Yao-Chun Chuang, Yu-Chen Hsu, Hao-Chun Liu, Chita Chuang, Chen-Shien Chen | 2024-10-08 |
| 12094728 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Hung-Jui Kuo +3 more | 2024-09-17 |
| 11961791 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen | 2024-04-16 |
| 11862512 | Semiconductor package and method of fabricating semiconductor package | Zi-Jheng Liu, Hung-Jui Kuo | 2024-01-02 |
| 11855025 | Semiconductor device and package assembly including the same | Chita Chuang, Yao-Chun Chuang, Tsung-Shu Lin, Chen-Shien Chen | 2023-12-26 |
| 11756929 | Semiconductor packages | Zi-Jheng Liu, Hung-Jui Kuo | 2023-09-12 |
| 11699598 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Hung-Jui Kuo +3 more | 2023-07-11 |
| 11342253 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen | 2022-05-24 |
| 11322479 | Semiconductor packages and manufacturing methods thereof | Zi-Jheng Liu, Hung-Jui Kuo | 2022-05-03 |
| 11244940 | Stress reduction apparatus and method | Yao-Chun Chuang, Yu-Chen Hsu, Hao-Chun Liu, Chita Chuang, Chen-Shien Chen | 2022-02-08 |
| 11088102 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang +1 more | 2021-08-10 |
| 10937688 | Semiconductor package and method of fabricating semiconductor package | Zi-Jheng Liu, Hung-Jui Kuo | 2021-03-02 |
| 10867811 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Hung-Jui Kuo +3 more | 2020-12-15 |
| 10861710 | Methods of manufacturing semiconductor devices | Hung-Jui Kuo, Ming-Tan Lee, De-Yuan Lu | 2020-12-08 |
| 10692848 | Stress reduction apparatus and method | Yao-Chun Chuang, Yu-Chen Hsu, Hao-Chun Liu, Chita Chuang, Chen-Shien Chen | 2020-06-23 |
| 10692838 | Semiconductor packages | Zi-Jheng Liu, Hung-Jui Kuo | 2020-06-23 |
| 10515917 | Bump on pad (BOP) bonding structure in semiconductor packaged device | Yao-Chun Chuang, Chita Chuang, Chen-Shien Chen | 2019-12-24 |
| 10510644 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen | 2019-12-17 |
| 10483225 | Packaging assembly and method of making the same | Chita Chuang, Yao-Chun Chunag, Tsung-Shu Lin, Chen-Shien Chen | 2019-11-19 |
| 10468366 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang +1 more | 2019-11-05 |
| 10304700 | Semiconductor device and method | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Shih-Hao Liao, Hung-Jui Kuo +3 more | 2019-05-28 |
| 10276428 | Semiconductor package and method of fabricating semiconductor package | Zi-Jheng Liu, Hung-Jui Kuo | 2019-04-30 |
| 10163858 | Semiconductor packages and manufacturing methods thereof | Zi-Jheng Liu, Hung-Jui Kuo | 2018-12-25 |