Issued Patents All Time
Showing 51–75 of 97 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8916971 | Multi-direction design for bump pad structures | Chih-Hua Chen, Chen-Shien Chen, Tzuan-Horng Liu | 2014-12-23 |
| 8901736 | Strength of micro-bump joints | Wen-Wei Shen, Chen-Shien Chen, Ming-Fa Chen, Rung-De Wang | 2014-12-02 |
| 8883628 | Electrical connection structure | Yao-Chun Chuang, Chang-Chia Huang, Tsung-Shu Lin, Chen-Shien Chen | 2014-11-11 |
| 8847387 | Robust joint structure for flip-chip bonding | Ching-Wen Hsiao, Yao-Chun Chuang, Chen-Shien Chen, Ru-Ying Huang | 2014-09-30 |
| 8829673 | Bonded structures for package and substrate | Ming-Hong Cha, Chita Chuang, Yao-Chun Chuang, Hao-Juin Liu, Tsung-Hsien Chiang +1 more | 2014-09-09 |
| 8772950 | Methods and apparatus for flip chip substrate with guard rings outside of a die attach region | Chita Chuang, Yao-Chun Chuang, Chen-Shien Chen | 2014-07-08 |
| 8765497 | Packaging and function tests for package-on-package and system-in-package structures | Hao-Juin Liu, Chita Chuang, Ching-Wen Hsiao, Chen-Shien Chen, Chih-Hua Chen | 2014-07-01 |
| 8753971 | Dummy metal design for packaging structures | Tzuan-Horng Liu, Shang-Yun Hou, Shin-Puu Jeng, Wei-Cheng Wu, Hsiu-Ping Wei +3 more | 2014-06-17 |
| 8729699 | Connector structures of integrated circuits | Shang-Yun Tu, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen | 2014-05-20 |
| 8729700 | Multi-direction design for bump pad structures | Chih-Hua Chen, Chen-Shien Chen, Tzuan-Horng Liu | 2014-05-20 |
| 8716123 | Method of forming an integrated circuit device | Chen-Shien Chen | 2014-05-06 |
| 8703609 | Through-substrate via for semiconductor device | Chen Chen-Shien, Kai-Ming Ching, Chih-Hua Chen | 2014-04-22 |
| 8659170 | Semiconductor device having conductive pads and a method of manufacturing the same | Tzuan-Horng Liu, Chen-Shien Chen | 2014-02-25 |
| 8659123 | Metal pad structures in dies | Yao-Chun Chuang, Chita Chuang, Chen-Shien Chen | 2014-02-25 |
| 8653648 | Zigzag pattern for TSV copper adhesion | Chih-Hua Chen, Chen-Shien Chen, Wen-Wei Shen | 2014-02-18 |
| 8604594 | Structures for preventing cross-talk between through-silicon vias and integrated circuits | — | 2013-12-10 |
| 8598030 | Process for making conductive post with footing profile | Chen-Shien Chen | 2013-12-03 |
| 8546941 | Multi-direction design for bump pad structures | Chih-Hua Chen, Chen-Shien Chen, Tzuan-Horng Liu | 2013-10-01 |
| 8476769 | Through-silicon vias and methods for forming the same | Chih-Hua Chen, Chen-Shien Chen, Kuo-Ching Hsu, Kai-Ming Ching | 2013-07-02 |
| 8476759 | Electrical connection structure | Yao-Chun Chuang, Chang-Chia Huang, Tsung-Shu Lin, Chen-Shien Chen | 2013-07-02 |
| 8456008 | Structure and process for the formation of TSVs | Kai-Ming Ching, Chen Chen-Shien | 2013-06-04 |
| 8299616 | T-shaped post for semiconductor devices | Yao-Chun Chuang, Ching-Wen Hsiao, Chen-Shien Chen | 2012-10-30 |
| 8278152 | Bonding process for CMOS image sensor | Jen-Cheng Liu, Dun-Nian Yaung, Chen-Shien Chen, Shou-Gwo Wuu | 2012-10-02 |
| 8232643 | Lead free solder interconnections for integrated circuits | Yao-Chun Chuang, Ching-Wen Hsiao, Chen-Shien Chen | 2012-07-31 |
| 8227924 | Substrate stand-offs for semiconductor devices | Cheng Hung Shen, Tin-Hao Kuo, Chen-Shien Chen, Yao-Chun Chuang | 2012-07-24 |