Issued Patents All Time
Showing 76–97 of 97 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8227902 | Structures for preventing cross-talk between through-silicon vias and integrated circuits | — | 2012-07-24 |
| 8202800 | Method of forming through silicon via with dummy structure | Chih-Hua Chen, Chen-Shien Chen, Wen-Wei Shen | 2012-06-19 |
| 8193639 | Dummy metal design for packaging structures | Tzuan-Horng Liu, Shang-Yun Hou, Shin-Puu Jeng, Wei-Cheng Wu, Hsiu-Ping Wei +3 more | 2012-06-05 |
| 8178970 | Strong interconnection post geometry | Wen-Wei Shen, Chen-Shien Chen, Chih-Hua Chen, Ching-Wen Hsiao | 2012-05-15 |
| 8049327 | Through-silicon via with scalloped sidewalls | Chih-Hua Chen, Ming-Fa Chen, Chen-Shien Chen | 2011-11-01 |
| 8034708 | Structure and process for the formation of TSVs | Kai-Ming Ching, Chen-Shien Chen | 2011-10-11 |
| 7973413 | Through-substrate via for semiconductor device | Chen Chen-Shien, Kai-Ming Ching, Chih-Hua Chen | 2011-07-05 |
| 7969013 | Through silicon via with dummy structure and method for forming the same | Chih-Hua Chen, Chen-Shien Chen, Wen-Wei Shen | 2011-06-28 |
| 7919406 | Structure and method for forming pillar bump structure having sidewall protection | Ming Hung Tseng, Young-Chang Lien, Chen-Shien Chen | 2011-04-05 |
| 7888236 | Semiconductor device and fabrication methods thereof | Han-Ping Pu, Bai-Yao Lou, Dean Wang, Ching-Wen Hsiao, Kai-Ming Ching +3 more | 2011-02-15 |
| 7843064 | Structure and process for the formation of TSVs | Kai-Ming Ching, Chen Chen-Shien | 2010-11-30 |
| 7816227 | Tapered through-silicon via structure | Chen-Shien Chen, Kai-Ming Ching, Chih-Hua Chen | 2010-10-19 |
| 7785927 | Multi-die wafer level packaging | Chen-Shien Chen, Kai-Ming Ching, Chih-Hua Chen | 2010-08-31 |
| 7564115 | Tapered through-silicon via structure | Chen-Shien Chen, Kai-Ming Ching, Chih-Hua Chen | 2009-07-21 |
| 7557423 | Semiconductor structure with a discontinuous material density for reducing eddy currents | Kai-Ming Ching, Chen Chen-Shien, Han-Hsiang Huang, Chih-Hua Chen | 2009-07-07 |
| 7514797 | Multi-die wafer level packaging | Chen-Shien Chen, Kai-Ming Ching, Chih-Hua Chen | 2009-04-07 |
| 7179085 | Apparatus for dispensing dental solutions | Denis P. Dorsey, Randall G. Cohen | 2007-02-20 |
| 6350680 | Pad alignment for AlCu pad for copper process | Tsu Shih, Hung-Chang Hsieh | 2002-02-26 |
| 6319821 | Dual damascene approach for small geometry dimension | Jen-Cheng Liu, Chia-Shiung Tsai, Hung-Chang Hsieh | 2001-11-20 |
| 6183916 | Method for proximity effect compensation on alternative phase-shift masks with bias and optical proximity correction | Hua-Tai Lin, Chia-Hui Lin | 2001-02-06 |
| 6021921 | Liquid dispensing system and method for dispensing | Ho-Ku Lan, Hung Chih Chen, Shih-Shiung Chen | 2000-02-08 |
| 5869219 | Method for depositing a polyimide film | Ho-Ku Lan, Hung Chih Chen, Shih-Shiung Chen | 1999-02-09 |