Issued Patents All Time
Showing 26–50 of 97 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163858 | Semiconductor packages and manufacturing methods thereof | Zi-Jheng Liu, Hung-Jui Kuo | 2018-12-25 |
| 9991218 | Connector structures of integrated circuits | Shang-Yun Tu, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen | 2018-06-05 |
| 9905524 | Bump structures in semiconductor device and packaging assembly | Chita Chuang, Yao-Chun Chuang, Tsung-Shu Lin, Chen-Shien Chen | 2018-02-27 |
| 9881885 | Metal routing architecture for integrated circuits | Chita Chuang, Chih-Hua Chen, Chen-Shien Chen, Yao-Chun Chuang | 2018-01-30 |
| 9786617 | Chip packages and methods of manufacture thereof | Zi-Jheng Liu, Chung-Shi Liu, Hung-Jui Kuo, Yu-Hsiang Hu | 2017-10-10 |
| 9768138 | Improving the strength of micro-bump joints | Wen-Wei Shen, Chen-Shien Chen, Ming-Fa Chen, Rung-De Wang | 2017-09-19 |
| 9748188 | Method of forming a bump on pad (BOP) bonding structure in a semiconductor packaged device | Chita Chuang, Chen-Shien Chen, Yao-Chun Chuang | 2017-08-29 |
| 9679836 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen | 2017-06-13 |
| 9673161 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang +1 more | 2017-06-06 |
| 9659903 | Method of manufacturing connector structures of integrated circuits | Shang-Yun Tu, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen | 2017-05-23 |
| 9472521 | Scheme for connector site spacing and resulting structures | Yao-Chun Chuang, Chita Chuang, Hao-Juin Liu, Chen-Shien Chen | 2016-10-18 |
| 9397059 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang +1 more | 2016-07-19 |
| 9373598 | Connector structures of integrated circuits | Shang-Yun Tu, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen | 2016-06-21 |
| 9312230 | Conductive pillar structure for semiconductor substrate and method of manufacture | Chih-Hua Chen, Chen-Shien Chen | 2016-04-12 |
| 9287191 | Semiconductor device package and method | Hao-Juin Liu, Chita Chuang, Chen-Shien Chen | 2016-03-15 |
| 9257412 | Stress reduction apparatus | Yao-Chun Chuang, Yu-Chen Hsu, Hao-Juin Liu, Chita Chuang, Chen-Shien Chen | 2016-02-09 |
| 9224688 | Metal routing architecture for integrated circuits | Chita Chuang, Yao-Chun Chuang, Chih-Hua Chen, Chen-Shien Chen | 2015-12-29 |
| 9219046 | Strength of micro-bump joints | Wen-Wei Shen, Chen-Shien Chen, Ming-Fa Chen, Rung-De Wang | 2015-12-22 |
| 9196573 | Bump on pad (BOP) bonding structure | Yao-Chun Chuang, Chita Chuang, Chen-Shien Chen | 2015-11-24 |
| 9142500 | Apparatus for lead free solder interconnections for integrated circuits | Yao-Chun Chuang, Ching-Wen Hsiao, Chen-Shien Chen | 2015-09-22 |
| 9129818 | Semiconductor device having conductive pads and a method of manufacturing the same | Tzuan-Horng Liu, Chen-Shien Chen | 2015-09-08 |
| 9123788 | Bonded structures for package and substrate | Ming-Hong Cha, Chita Chuang, Yao-Chun Chuang, Hao-Juin Liu, Tsung-Hsien Chiang +1 more | 2015-09-01 |
| 9093440 | Connector structures of integrated circuits | Shang-Yun Tu, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen | 2015-07-28 |
| 9053989 | Elongated bump structure in semiconductor device | Chita Chuang, Tsung-Shu Lin, Chen-Shien Chen | 2015-06-09 |
| 9040350 | Packaging and function tests for package-on-package and system-in-package structures | Hao-Juin Liu, Chita Chuang, Ching-Wen Hsiao, Chen-Shien Chen, Chih-Hua Chen | 2015-05-26 |