Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230593 | Wafer level package with polymer layer delamination prevention design and method of forming the same | Kai-Heng CHEN, Pei-Haw Tsao, Shyue-Ter Leu, Chien-Chun Wang | 2025-02-18 |
| 11855007 | Semiconductor structure | Chen-Hsun Liu, Chin-Yu Ku, Te-Hsun Pang, Chia-Hua Wang, Pei-Shing Tsai +1 more | 2023-12-26 |
| 11348879 | Semiconductor structure | Chen-Hsun Liu, Chin-Yu Ku, Te-Hsun Pang, Chia-Hua Wang, Pei-Shing Tsai +1 more | 2022-05-31 |
| 10818612 | Manufacturing method of semiconductor structure | Chen-Hsun Liu, Chin-Yu Ku, Te-Hsun Pang, Chia-Hua Wang, Pei-Shing Tsai +1 more | 2020-10-27 |
| 10276514 | Semiconductor structure and manufacturing method thereof | Chen-Hsun Liu, Chin-Yu Ku, Te-Hsun Pang, Chia-Hua Wang, Pei-Shing Tsai +1 more | 2019-04-30 |
| 9837366 | Semicondcutor structure and semiconductor manufacturing process thereof | Chen-Hsun Liu, Chin-Yu Ku, Wei-Lun Hsieh, Chia-Hua Wang, Jheng-Hong Chen +1 more | 2017-12-05 |
| 9768138 | Improving the strength of micro-bump joints | Wen-Wei Shen, Chen-Shien Chen, Chen-Cheng Kuo, Ming-Fa Chen | 2017-09-19 |
| 9219046 | Strength of micro-bump joints | Wen-Wei Shen, Chen-Shien Chen, Chen-Cheng Kuo, Ming-Fa Chen | 2015-12-22 |
| 8901736 | Strength of micro-bump joints | Wen-Wei Shen, Chen-Shien Chen, Chen-Cheng Kuo, Ming-Fa Chen | 2014-12-02 |