Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984419 | Package structure with a barrier layer | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li +7 more | 2024-05-14 |
| 11855007 | Semiconductor structure | Rung-De Wang, Chen-Hsun Liu, Chin-Yu Ku, Chia-Hua Wang, Pei-Shing Tsai +1 more | 2023-12-26 |
| 11527504 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang +8 more | 2022-12-13 |
| 11469203 | Method for forming package structure with a barrier layer | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li +7 more | 2022-10-11 |
| 11348879 | Semiconductor structure | Rung-De Wang, Chen-Hsun Liu, Chin-Yu Ku, Chia-Hua Wang, Pei-Shing Tsai +1 more | 2022-05-31 |
| 10818612 | Manufacturing method of semiconductor structure | Rung-De Wang, Chen-Hsun Liu, Chin-Yu Ku, Chia-Hua Wang, Pei-Shing Tsai +1 more | 2020-10-27 |
| 10811377 | Package structure with a barrier layer and method for forming the same | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li +7 more | 2020-10-20 |
| 10741513 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang +8 more | 2020-08-11 |
| 10276514 | Semiconductor structure and manufacturing method thereof | Rung-De Wang, Chen-Hsun Liu, Chin-Yu Ku, Chia-Hua Wang, Pei-Shing Tsai +1 more | 2019-04-30 |
| 10163836 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang +8 more | 2018-12-25 |
| 9875979 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang +8 more | 2018-01-23 |
| 6379491 | Plasma chamber with erosion resistive securement screws | Ray C. Lee, Tonny Shu, Birdson Lee | 2002-04-30 |