Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300565 | Chip package unit and chip packaging method | Hao-Lin Yen, Yong-Zhong Hu | 2025-05-13 |
| 11984419 | Package structure with a barrier layer | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Chien-Chen Li, Shih-Yen Chen +7 more | 2024-05-14 |
| 11973010 | Chip packaging method and chip package unit | Hao-Lin Yen, Yong-Zhong Hu | 2024-04-30 |
| 11469203 | Method for forming package structure with a barrier layer | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Chien-Chen Li, Shih-Yen Chen +7 more | 2022-10-11 |
| 11469162 | Plurality of vertical heat conduction elements attached to metal film | Hao-Lin Yen, Yong-Zhong Hu | 2022-10-11 |
| 10811377 | Package structure with a barrier layer and method for forming the same | Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Chien-Chen Li, Shih-Yen Chen +7 more | 2020-10-20 |
| 10170429 | Method for forming package structure including intermetallic compound | Chien-Chen Li, Kuo-Lung Li, Cheng-Liang Cho, Che-Jung Chu, Kuo-Chio Liu | 2019-01-01 |
| 7947430 | Method of forming 3D micro structures with high aspect ratios | Chien-Chung Fu, Wen-Cheng Yang | 2011-05-24 |
| 7384729 | Method of manufacturing a LIGA mold by backside exposure | Chien-Chung Fu | 2008-06-10 |