Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300565 | Chip package unit and chip packaging method | Heng-Chi Huang, Yong-Zhong Hu | 2025-05-13 |
| 11973010 | Chip packaging method and chip package unit | Heng-Chi Huang, Yong-Zhong Hu | 2024-04-30 |
| 11469162 | Plurality of vertical heat conduction elements attached to metal film | Heng-Chi Huang, Yong-Zhong Hu | 2022-10-11 |