Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218001 | Semiconductor package and method of fabricating semiconductor package | Chen-Cheng Kuo, Hung-Jui Kuo | 2025-02-04 |
| 12197138 | Machine learning on overlay management | Tzu-Cheng Lin, Chien Rhone Wang, Kewei Zuo, Ming-Tan Lee | 2025-01-14 |
| 12125741 | Semiconductor package and method of fabricating semiconductor package | Chen-Cheng Kuo, Hung-Jui Kuo | 2024-10-22 |
| 12094728 | Semiconductor device | Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo, Hung-Jui Kuo +3 more | 2024-09-17 |
| 11862512 | Semiconductor package and method of fabricating semiconductor package | Chen-Cheng Kuo, Hung-Jui Kuo | 2024-01-02 |
| 11817399 | Semiconductor device | Jo-Lin Lan, Yu-Hsiang Hu, Hung-Jui Kuo | 2023-11-14 |
| 11756929 | Semiconductor packages | Chen-Cheng Kuo, Hung-Jui Kuo | 2023-09-12 |
| 11699598 | Semiconductor device | Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo, Hung-Jui Kuo +3 more | 2023-07-11 |
| 11322479 | Semiconductor packages and manufacturing methods thereof | Chen-Cheng Kuo, Hung-Jui Kuo | 2022-05-03 |
| 11177165 | Method of manufacturing a semiconductor device having redistribution layer including a dielectric layer made from a low-temperature cure polyimide | Yu-Hsiang Hu, Hung-Jui Kuo | 2021-11-16 |
| 11127688 | Semiconductor package and manufacturing method thereof | Hung-Jui Kuo, Ming-Tan Lee | 2021-09-21 |
| 11037877 | Package structure and method of manufacturing the same | Hung-Jui Kuo, Ming-Tan Lee | 2021-06-15 |
| 11031351 | Method of manufacturing a semiconductor device | Jo-Lin Lan, Yu-Hsiang Hu, Hung-Jui Kuo | 2021-06-08 |
| 10937688 | Semiconductor package and method of fabricating semiconductor package | Chen-Cheng Kuo, Hung-Jui Kuo | 2021-03-02 |
| 10879166 | Package structure having redistribution structure with photosensitive and non-photosensitive dielectric materials and fabricating method thereof | Hung-Jui Kuo, Ming-Tan Lee | 2020-12-29 |
| 10867793 | Semiconductor package and method of fabricating the same | Hung-Jui Kuo, Ming-Che Ho, Ming-Tan Lee, Tzung-Hui Lee | 2020-12-15 |
| 10867811 | Semiconductor device | Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo, Hung-Jui Kuo +3 more | 2020-12-15 |
| 10692838 | Semiconductor packages | Chen-Cheng Kuo, Hung-Jui Kuo | 2020-06-23 |
| 10685896 | Integrated circuit package and method of fabricating the same | Hung-Jui Kuo, Yu-Hsiang Hu | 2020-06-16 |
| 10304700 | Semiconductor device and method | Yu-Hsiang Hu, Jo-Lin Lan, Shih-Hao Liao, Chen-Cheng Kuo, Hung-Jui Kuo +3 more | 2019-05-28 |
| 10276428 | Semiconductor package and method of fabricating semiconductor package | Chen-Cheng Kuo, Hung-Jui Kuo | 2019-04-30 |
| 10204870 | Semiconductor device and method of manufacturing the same | Jo-Lin Lan, Yu-Hsiang Hu, Hung-Jui Kuo | 2019-02-12 |
| 10163858 | Semiconductor packages and manufacturing methods thereof | Chen-Cheng Kuo, Hung-Jui Kuo | 2018-12-25 |
| 10090194 | Semiconductor device and method | Yu-Hsiang Hu, Hung-Jui Kuo | 2018-10-02 |
| 10049986 | Package structures and methods of making the same | Chung-Shi Liu, Hung-Jui Kuo, Yu-Hsiang Hu | 2018-08-14 |