Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094830 | Integrated fan-out (InFO) package structure | Ming-Che Ho, Hung-Jui Kuo | 2024-09-17 |
| 11855014 | Semiconductor device and method | Chen-Hua Yu, Ming-Che Ho, Hung-Jui Kuo, Yi-Wen Wu | 2023-12-26 |
| 11848233 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Bor-Rung Su, De-Yuan Lu, Hao-Yi Tsai, Tin-Hao Kuo +1 more | 2023-12-19 |
| 11842955 | Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a redistribution structure | Chen-Hua Yu, Hung-Jui Kuo, Ming-Che Ho | 2023-12-12 |
| 11410918 | Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a carrier | Chen-Hua Yu, Hung-Jui Kuo, Ming-Che Ho | 2022-08-09 |
| 11398416 | Package structure and method of fabricating the same | Hung-Jui Kuo, Ming-Che Ho | 2022-07-26 |
| 11393763 | Integrated fan-out (info) package structure and method | Ming-Che Ho, Hung-Jui Kuo | 2022-07-19 |
| 11289373 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Bor-Rung Su, De-Yuan Lu, Hao-Yi Tsai, Tin-Hao Kuo +1 more | 2022-03-29 |
| 11289410 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Hung-Jui Kuo, Ming-Che Ho | 2022-03-29 |
| 11217518 | Package structure and method of forming the same | Hung-Jui Kuo, Ming-Che Ho | 2022-01-04 |
| 10867941 | Semiconductor device and method | Chen-Hua Yu, Ming-Che Ho, Hung-Jui Kuo, Yi-Wen Wu | 2020-12-15 |
| 10867793 | Semiconductor package and method of fabricating the same | Zi-Jheng Liu, Hung-Jui Kuo, Ming-Che Ho, Ming-Tan Lee | 2020-12-15 |
| 10861814 | Integrated fan-out packages and methods of forming the same | Chen-Hua Yu, Chi-Ming Tsai, Hung-Jui Kuo, Ming-Che Ho | 2020-12-08 |
| 10510646 | Packae structure, RDL structure and method of forming the same | Hung-Jui Kuo, Ming-Che Ho | 2019-12-17 |
| 10461023 | Semiconductor packages and methods of forming the same | Mao-Yen Chang, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo, Teng-Yuan Lo +1 more | 2019-10-29 |
| 10297560 | Semiconductor device and method | Chen-Hua Yu, Ming-Che Ho, Hung-Jui Kuo, Yi-Wen Wu | 2019-05-21 |
| 10074623 | Method of fabricating redistribution circuit structure | Hung-Jui Kuo, Ming-Che Ho, Tzu-Yun Huang | 2018-09-11 |
| 9899342 | Integrated fan-out package, redistribution circuit structure, and method of fabricating the same | Hung-Jui Kuo, Ming-Che Ho, Tzu-Yun Huang | 2018-02-20 |
| 9871009 | Semiconductor device and method | Chen-Hua Yu, Ming-Che Ho, Hung-Jui Kuo, Yi-Wen Wu | 2018-01-16 |