Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237188 | Machine learning on overlay management | Tzu-Cheng Lin, Y. Y. Peng, Jerry Wang, Chien Rhone Wang | 2025-02-25 |
| 12197138 | Machine learning on overlay management | Tzu-Cheng Lin, Chien Rhone Wang, Ming-Tan Lee, Zi-Jheng Liu | 2025-01-14 |
| 11626304 | Machine learning on overlay management | Tzu-Cheng Lin, Y. Y. Peng, Jerry Wang, Chien Rhone Wang | 2023-04-11 |
| 10964566 | Machine learning on overlay virtual metrology | Tzu-Cheng Lin, Y. Y. Peng, Jerry Wang, Chien Rhone Wang | 2021-03-30 |
| 10054938 | Clustering for prediction models in process control and for optimal dispatching | Jung Cheng Ko, Tzu-Yu Wang, Kuan Teng Lo, Chien Rhone Wang, Chih-Wei Lai | 2018-08-21 |
| 9698030 | Temperature controlled loadlock chamber | Chun-Hsien Lin, Jyh-Cherng Sheu, Ming-Feng Yoo | 2017-07-04 |
| 9588505 | Near non-adaptive virtual metrology and chamber control | Tzu-Yu Wang, Chen-Hua Yu, Chien Rhone Wang, Henry Lo, Jung Cheng Ko +1 more | 2017-03-07 |
| 9508653 | Die-tracing in integrated circuit manufacturing and packaging | Wen-Yao Chang, Chien Rhone Wang | 2016-11-29 |
| 9390060 | Packaging methods, material dispensing methods and apparatuses, and automated measurement systems | Chien Rhone Wang, Chih-Wei Lai, Chih-Chiang Chang, Jing-Cheng Lin | 2016-07-12 |
| 9390491 | System and method for automatic quality control for assembly line processes | Chien Rhone Wang, Tzu-Cheng Lin, Chih-Wei Lai | 2016-07-12 |
| 9177843 | Preventing contamination in integrated circuit manufacturing lines | Chien-Ming Sung, Simon Wang, Jia-Ren Chen, Henry Lo, Chen-Hua Yu +1 more | 2015-11-03 |
| 9153506 | System and method for through silicon via yield | Chien Rhone Wang, Chen-Hua Yu, Jing-Cheng Lin, Yen-Hsin Liu | 2015-10-06 |
| 9037279 | Clustering for prediction models in process control and for optimal dispatching | Francis Ko, Tzu-Yu Wang, Henry Lo, Jean Wang, Chih-Wei Lai | 2015-05-19 |
| 9010617 | Solder joint reflow process for reducing packaging failure rate | Chen-Hua Yu, Wen-Yao Chang, Chien Rhone Wang, Chung-Shi Liu | 2015-04-21 |
| 8945983 | System and method to improve package and 3DIC yield in underfill process | Yen-Hsin Liu, Cing-He Chen, Chien Rhone Wang | 2015-02-03 |
| 8905124 | Temperature controlled loadlock chamber | Chun-Hsien Lin, Jyh-Cherng Sheu, Ming-Feng Yoo | 2014-12-09 |
| 8682466 | Automatic virtual metrology for semiconductor wafer result prediction | Francis Ko, Chih-Wei Lai, Henry Lo, Jean Wang, Ping-Hsu Chen +2 more | 2014-03-25 |
| 8433434 | Near non-adaptive virtual metrology and chamber control | Amy Wang, Chen-Hua Yu, Jean Wang, Henry Lo, Francis Ko +1 more | 2013-04-30 |
| 7972969 | Method and apparatus for thinning a substrate | Ku-Feng Yang, Wen-Chih Chiou, Weng-Jin Wu | 2011-07-05 |
| 7974728 | System for extraction of key process parameters from fault detection classification to enable wafer prediction | Chun-Hsien Lin, Francis Ko, Henry Lo, Jean Wang | 2011-07-05 |