Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9536847 | Bump pad structure | Hsien-Wei Chen, Hao-Yi Tsai, Ying-Ju Chen, Yu-Wen Liu | 2017-01-03 |
| 9171811 | Bump pad structure | Hao-Yi Tsai, Hsien-Wei Chen, Yu-Wen Liu, Ying-Ju Chen | 2015-10-27 |
| 8907478 | Bump pad structure | Hao-Yi Tsai, Hsien-Wei Chen, Yu-Wen Liu, Ying-Ju Chen | 2014-12-09 |
| 8753971 | Dummy metal design for packaging structures | Tzuan-Horng Liu, Shang-Yun Hou, Shin-Puu Jeng, Wei-Cheng Wu, Chih-Hua Chen +3 more | 2014-06-17 |
| 8405211 | Bump pad structure | Hao-Yi Tsai, Hsien-Wei Chen, Yu-Wen Liu, Ying-Ju Chen | 2013-03-26 |
| 8227916 | Package structure and method for reducing dielectric layer delamination | Shin-Puu Jeng, Hao-Yi Tsai, Hsien-Wei Chen, Yu-Wen Liu, Ying-Ju Chen +1 more | 2012-07-24 |
| 8193639 | Dummy metal design for packaging structures | Tzuan-Horng Liu, Shang-Yun Hou, Shin-Puu Jeng, Wei-Cheng Wu, Chih-Hua Chen +3 more | 2012-06-05 |
| 8030776 | Integrated circuit with protective structure | Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Hao-Yi Tsai, Hsien-Wei Chen | 2011-10-04 |