Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8703609 | Through-substrate via for semiconductor device | Chen-Cheng Kuo, Kai-Ming Ching, Chih-Hua Chen | 2014-04-22 |
| 8456008 | Structure and process for the formation of TSVs | Chen-Cheng Kuo, Kai-Ming Ching | 2013-06-04 |
| 7973413 | Through-substrate via for semiconductor device | Chen-Cheng Kuo, Kai-Ming Ching, Chih-Hua Chen | 2011-07-05 |
| 7843064 | Structure and process for the formation of TSVs | Chen-Cheng Kuo, Kai-Ming Ching | 2010-11-30 |
| 7557423 | Semiconductor structure with a discontinuous material density for reducing eddy currents | Kai-Ming Ching, Han-Hsiang Huang, Chih-Hua Chen, Chen-Cheng Kuo | 2009-07-07 |