Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431452 | Semiconductor package including corner bumps coaxially offset from the pads and non-corner bumps coaxially aligned with the pads | Chiang-Jui Chu, Ching-Wen Hsiao | 2025-09-30 |
| 12412857 | Hybrid micro-bump integration with redistribution layer | Ting-Li Yang, Po-Hao Tsai, Yi-Wen Wu, Sheng-Pin Yang | 2025-09-09 |
| 12394096 | Error correction method and device for line structured light 3D camera, computer device and computer-readable storage medium | Zhipeng WEI, Xuyang He, Yangyang Guo, Weikang Wu, Biao Xia +1 more | 2025-08-19 |
| 12272664 | Semiconductor packages having conductive pillars with inclined surfaces | Chiang-Jui Chu, Ching-Wen Hsiao, Ming-Da Cheng, Young-Hwa Wu, Tao-Sheng Chang | 2025-04-08 |
| 12174016 | Chip-scale frequency-comb assisted coherent lidar ranging with sub-micrometer precision | Yoon Soo Jang, Chee Wei Wong, Jinghui Yang | 2024-12-24 |
| 12113055 | Stress reduction apparatus and method | Yao-Chun Chuang, Yu-Chen Hsu, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2024-10-08 |
| 12051622 | Passivation layer and planarization layer and method of forming the same | Ming-Da Cheng, Tzy-Kuang Lee, Po-Hao Tsai, Chih-Hsien Lin, Ching-Wen Hsiao | 2024-07-30 |
| 12021048 | Semiconductor device | Chien-Hao Hsu, Yen-Kun Lai, Wei-Hsiang Tu, Kuo-Chin Chang, Mirng-Ji Lii | 2024-06-25 |
| 11990428 | Bonding structures in semiconductor packaged device and method of forming same | Ching-Wen Hsiao, Kuo-Ching Hsu, Mirng-Ji Lii | 2024-05-21 |
| 11901323 | Semiconductor packages having conductive pillars with inclined surfaces | Chiang-Jui Chu, Ching-Wen Hsiao, Ming-Da Cheng, Young-Hwa Wu, Tao-Sheng Chang | 2024-02-13 |
| 11855028 | Hybrid micro-bump integration with redistribution layer | Ting-Li Yang, Po-Hao Tsai, Yi-Wen Wu, Sheng-Pin Yang | 2023-12-26 |
| 11398444 | Semiconductor packages having conductive pillars with inclined surfaces and methods of forming the same | Chiang-Jui Chu, Ching-Wen Hsiao, Ming-Da Cheng, Young-Hwa Wu, Tao-Sheng Chang | 2022-07-26 |
| 11393771 | Bonding structures in semiconductor packaged device and method of forming same | Ching-Wen Hsiao, Kuo-Ching Hsu, Mirng-Ji Lii | 2022-07-19 |
| 11244940 | Stress reduction apparatus and method | Yao-Chun Chuang, Yu-Chen Hsu, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2022-02-08 |
| 11021179 | Method for detecting whether point rail of turnout is attached to stock rail | Jun Hu, Mengfei Wu, Kangyu Liang, Yuqi Wei, Junjie Yang | 2021-06-01 |
| 10692848 | Stress reduction apparatus and method | Yao-Chun Chuang, Yu-Chen Hsu, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2020-06-23 |
| 8500493 | Electrical connector with improved metal shell | Zi-Qiang Zhu, Jia-Wei Gu, Bo Yang | 2013-08-06 |