Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431452 | Semiconductor package including corner bumps coaxially offset from the pads and non-corner bumps coaxially aligned with the pads | Ching-Wen Hsiao, Hao-Chun Liu | 2025-09-30 |
| 12272664 | Semiconductor packages having conductive pillars with inclined surfaces | Ching-Wen Hsiao, Hao-Chun Liu, Ming-Da Cheng, Young-Hwa Wu, Tao-Sheng Chang | 2025-04-08 |
| 11901323 | Semiconductor packages having conductive pillars with inclined surfaces | Ching-Wen Hsiao, Hao-Chun Liu, Ming-Da Cheng, Young-Hwa Wu, Tao-Sheng Chang | 2024-02-13 |
| 11398444 | Semiconductor packages having conductive pillars with inclined surfaces and methods of forming the same | Ching-Wen Hsiao, Hao-Chun Liu, Ming-Da Cheng, Young-Hwa Wu, Tao-Sheng Chang | 2022-07-26 |
| 11282785 | Wireless charging package with chip integrated in coil center | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo | 2022-03-22 |
| 10720388 | Wireless charging package with chip integrated in coil center | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo | 2020-07-21 |
| 10163780 | Wireless charging package with chip integrated in coil center | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo | 2018-12-25 |
| 9761522 | Wireless charging package with chip integrated in coil center | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Ming Hung Tseng, Hung-Yi Kuo | 2017-09-12 |