Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272664 | Semiconductor packages having conductive pillars with inclined surfaces | Chiang-Jui Chu, Ching-Wen Hsiao, Hao-Chun Liu, Ming-Da Cheng, Tao-Sheng Chang | 2025-04-08 |
| 11901323 | Semiconductor packages having conductive pillars with inclined surfaces | Chiang-Jui Chu, Ching-Wen Hsiao, Hao-Chun Liu, Ming-Da Cheng, Tao-Sheng Chang | 2024-02-13 |
| 11398444 | Semiconductor packages having conductive pillars with inclined surfaces and methods of forming the same | Chiang-Jui Chu, Ching-Wen Hsiao, Hao-Chun Liu, Ming-Da Cheng, Tao-Sheng Chang | 2022-07-26 |