Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374638 | Passivation structure for metal pattern | Ching-Hung Kao, Kuei-Yu Deng | 2025-07-29 |
| 12354959 | Redistribution layer features | Wen-Chun Wang, Chih-Hsien Lin, Ching-Hung Kao, Yen-Yu Chen | 2025-07-08 |
| 12266684 | High density capacitor | Pei-Jen Wang, Ching-Hung Kao, Meng-Chang Ho, Kun-Mao Wu | 2025-04-01 |
| 12255131 | Capacitor between two passivation layers with different etching rates | Chia-Ming Huang, Ming-Da Cheng, Songbor Lee, Jung-You Chen, Ching-Hua Kuan | 2025-03-18 |
| 12051622 | Passivation layer and planarization layer and method of forming the same | Ming-Da Cheng, Hao-Chun Liu, Po-Hao Tsai, Chih-Hsien Lin, Ching-Wen Hsiao | 2024-07-30 |
| 11961762 | Package component with stepped passivation layer | Ming-Da Cheng, Song-Bor Lee, Wen-Hsiung Lu, Po-Hao Tsai, Wen-Che Chang | 2024-04-16 |
| 11935826 | Capacitor between two passivation layers with different etching rates | Chia-Ming Huang, Ming-Da Cheng, Songbor Lee, Jung-You Chen, Ching-Hua Kuan | 2024-03-19 |
| 11670594 | Redistribution layer features | Wen-Chun Wang, Chih-Hsien Lin, Ching-Hung Kao, Yen-Yu Chen | 2023-06-06 |
| 11621165 | Blocking structures on isolation structures | Yu-Hsuan Yang, Wen-Han Hung, Chia-Ying Lin | 2023-04-04 |
| 11450567 | Package component with stepped passivation layer | Ming-Da Cheng, Song-Bor Lee, Wen-Hsiung Lu, Po-Hao Tsai, Wen-Che Chang | 2022-09-20 |
| 10930502 | Blocking structures on isolation structures | Yu-Hsuan Yang, Wen-Han Hung, Chia-Ying Lin | 2021-02-23 |
| 10283361 | Blocking structures on isolation structures | Yu-Hsuan Yang, Wen-Han Hung, Chia-Ying Lin | 2019-05-07 |
| 10156478 | System and method of monitoring and controlling temperature of semiconductor substrates in FOUP | Chun-Chang Liu | 2018-12-18 |
| 9934925 | Fuse structures and forming and operation methods thereof | Chia-Chou Tsai, Mu-Yi Lin | 2018-04-03 |