Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11961762 | Package component with stepped passivation layer | Ming-Da Cheng, Tzy-Kuang Lee, Song-Bor Lee, Wen-Hsiung Lu, Po-Hao Tsai | 2024-04-16 |
| 11450567 | Package component with stepped passivation layer | Ming-Da Cheng, Tzy-Kuang Lee, Song-Bor Lee, Wen-Hsiung Lu, Po-Hao Tsai | 2022-09-20 |
| 9412671 | Method for controlling processing temperature in semiconductor fabrication | Hsien-Chie Tsai, Chang-Sheng Lee, Fu-Yuan Chang, Hung-Yin Lin, Chien-Pin Sherman Hsu | 2016-08-09 |