Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021048 | Semiconductor device | Yen-Kun Lai, Wei-Hsiang Tu, Hao-Chun Liu, Kuo-Chin Chang, Mirng-Ji Lii | 2024-06-25 |
| 12009327 | Semiconductor die | Yen-Kun Lai, Wei-Hsiang Tu, Kuo-Chin Chang, Mirng-Ji Lii | 2024-06-11 |
| 11791576 | Electrical connector assembly and electrical connector thereof | Ho-Ching Huang, Chyi-Nan Chen, Chuan-Yuan Lin, Po-Chun Chen | 2023-10-17 |
| 11450588 | Method for forming chip package structure with heat conductive layer | Shin CHI, Kuo-Chin Chang, Cheng-Nan Lin, Mirng-Ji Lii | 2022-09-20 |
| 11222859 | Semiconductor device structure with bonding pad and method for forming the same | Wei-Hsiang Tu, Kuo-Chin Chang, Mirng-Ji Lii | 2022-01-11 |