Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7666688 | Method of manufacturing a coil inductor | Chen-Shien Chen | 2010-02-23 |
| 7564115 | Tapered through-silicon via structure | Chen-Shien Chen, Chen-Cheng Kuo, Chih-Hua Chen | 2009-07-21 |
| 7557423 | Semiconductor structure with a discontinuous material density for reducing eddy currents | Chen Chen-Shien, Han-Hsiang Huang, Chih-Hua Chen, Chen-Cheng Kuo | 2009-07-07 |
| 7514797 | Multi-die wafer level packaging | Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo | 2009-04-07 |
| 7468321 | Application of impressed-current cathodic protection to prevent metal corrosion and oxidation | Chia-Fu Lin, Wen-Hsiang Tseng, Ta-Min Lin, Yen-Ming Chen, Hsin-Hui Lee +1 more | 2008-12-23 |
| 7276454 | Application of impressed-current cathodic protection to prevent metal corrosion and oxidation | Chia-Fu Lin, Wen-Hsiang Tseng, Ta-Min Lin, Yen-Ming Chen, Hsin-Hui Lee +2 more | 2007-10-02 |
| 7134199 | Fluxless bumping process | Chao-Yuan Su, Chia-Fu Lin, Hsin-Hui Lee, Yen-Ming Chen, Li-Chih Chen +2 more | 2006-11-14 |
| 6974659 | Method of forming a solder ball using a thermally stable resinous protective layer | Chao-Yuan Su, Chia-Fu Lin, Hsin-Hui Lee, Yen-Ming Chen, Li-Chih Chen | 2005-12-13 |
| 6926818 | Method to enhance the adhesion between dry film and seed metal | Yih-Ann Lin, Tung-Heng Shie, Sheng-Liang Pan, Kuo-Liang Lu | 2005-08-09 |
| 6918397 | Flush system for dry film photoresist remover | Ta-Min Lin, Szu-Yao Wang, Chia-Fu Lin, Wen-Hsiang Tseng | 2005-07-19 |
| 6802250 | Stencil design for solder paste printing | Chao-Yuan Su, Chia-Fu Lin, Hsin-Hui Lee, Yen-Ming Chen, Li-Chih Chen | 2004-10-12 |
| 6797075 | Ferris wheel-like stripping or cleaning mechanism for semiconductor fabrication | Chia-Fu Lin, Wen-Hsiang Tseng, Ta-Min Lin, Yen-Ming Chen, Hsin-Hui Lee | 2004-09-28 |
| 6756294 | Method for improving bump reliability for flip chip devices | Yen-Ming Chen, Chia-Fu Lin, Shun-Liang Hsu, Hsin-Hui Lee, Chao-Yuan Su +1 more | 2004-06-29 |
| 6743660 | Method of making a wafer level chip scale package | Hsin-Hui Lee, Chia-Fu Lin, Chao-Yuan Su, Yen-Ming Chen, Li-Chih Chen | 2004-06-01 |
| 6715524 | DFR laminating and film removing system | Li-Chen Chen, Chia-Tsun Hsu, Chia-Fu Lin, Kuo-Ching Lee, Yen-Ming Chen +2 more | 2004-04-06 |
| 6696356 | Method of making a bump on a substrate without ribbon residue | Li-Hsin Tseng, Hsiu-Mei Yu, Ta-Yang Lin, Fang-Chung Liu, Tung-Heng Shie | 2004-02-24 |
| 6638688 | Selective electroplating method employing annular edge ring cathode electrode contact | Sheng-Liang Pan, Hao-Wei Chang, Chun-Hong Chang, Yen-Ming Chen | 2003-10-28 |
| 6636313 | Method of measuring photoresist and bump misalignment | Yen-Ming Chen, Chia-Fu Lin, Chao-Yuan Su, Hsin-Hui Lee, Li-Chih Chen | 2003-10-21 |
| 6623912 | Method to form the ring shape contact to cathode on wafer edge for electroplating in the bump process when using the negative type dry film photoresist | Yu-Kung Hsiao, Sheng-Liang Pan, Kuo-Liang Lu | 2003-09-23 |
| 6602775 | Method to improve reliability for flip-chip device for limiting pad design | Yen-Ming Chen, Chia-Fu Lin, Hsin-Hui Lee, Chao-Yuan Su, Li-Chi Chen | 2003-08-05 |