FL

Fang-Chung Liu

TSMC: 1 patents #8,466 of 12,232Top 70%
Overall (All Time): #3,471,006 of 4,157,543Top 85%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6696356 Method of making a bump on a substrate without ribbon residue Li-Hsin Tseng, Hsiu-Mei Yu, Ta-Yang Lin, Kai-Ming Ching, Tung-Heng Shie 2004-02-24