Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7678655 | Spacer layer etch method providing enhanced microelectronic device performance | Hung-Der Su, Ju-Wang Hsu, Yi-Chun Huang, Shien-Yang Wu, Yung-Shun Chen +3 more | 2010-03-16 |
| 6926818 | Method to enhance the adhesion between dry film and seed metal | Yih-Ann Lin, Kai-Ming Ching, Sheng-Liang Pan, Kuo-Liang Lu | 2005-08-09 |
| 6828198 | System-on-chip (SOC) solutions with multiple devices by multiple poly gate trimming process | Hung-Der Su, Shien-Yang Wu, Yung-Shun Chen, Yuan-Hung Chiu | 2004-12-07 |
| 6696356 | Method of making a bump on a substrate without ribbon residue | Li-Hsin Tseng, Hsiu-Mei Yu, Ta-Yang Lin, Fang-Chung Liu, Kai-Ming Ching | 2004-02-24 |