Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11690737 | Stent using wireless transmitted power and external operating apparatus thereof | Myung gyu Choi, Seok-Hyun Yun, Jae Myung Park, Ehsan Kamrani, Ali Kemal Yetisen | 2023-07-04 |
| 11413722 | Apparatus and method for chemically mechanically polishing | — | 2022-08-16 |
| 10857649 | Method and apparatus for performing a polishing process in semiconductor fabrication | Huang Soon Kang, Chi-Ming Yang, Chin-Hsiang Lin | 2020-12-08 |
| 10668592 | Method of planarizing a wafer | Soon-Kang Huang, Chi-Ming Yang, Chin-Hsiang Lin | 2020-06-02 |
| 10163710 | Method of manufacturing semiconductor device by applying molding layer in substrate groove | Tsung-Ding Wang, Jung Wei Cheng | 2018-12-25 |
| 9754917 | Method of forming wafer-level molded structure for package assembly | Tsung-Ding Wang, Chien-Hsun Lee | 2017-09-05 |
| 9673174 | Through silicon via bonding structure | Tsung-Ding Wang, Chen-Shien Chen, Kai-Ming Ching, Chien-Hsun Lee | 2017-06-06 |
| 9570368 | Method of manufacturing semiconductor package including forming a recessed region in a substrate | Tsung-Ding Wang, Jung Wei Cheng | 2017-02-14 |
| 9403254 | Methods for real-time error detection in CMP processing | James Jeng-Jyi Hwang, Chi-Ming Yang, Chin-Hsiang Lin | 2016-08-02 |
| 9406632 | Semiconductor package including a substrate with a stepped sidewall structure | Tsung-Ding Wang, Jung Wei Cheng | 2016-08-02 |
| 9275924 | Semiconductor package having a recess filled with a molding compound | Tsung-Ding Wang, Jung Wei Cheng | 2016-03-01 |
| 9242342 | Manufacture and method of making the same | Huang Soon Kang, Chi-Ming Yang, Chin-Hsiang Lin | 2016-01-26 |
| 9138861 | CMP pad cleaning apparatus | Jiann Lih Wu, Huang Soon Kang, Chi-Ming Yang, Chin-Hsiang Lin | 2015-09-22 |
| 9117939 | Method of forming wafer-level molded structure for package assembly | Tsung-Ding Wang, Chien-Hsun Lee | 2015-08-25 |
| 8932906 | Through silicon via bonding structure | Dean Wang, Chen-Shien Chen, Kai-Ming Ching, Chien-Hsiun Lee | 2015-01-13 |
| 8803332 | Delamination resistance of stacked dies in die saw | Tsung-Ding Wang | 2014-08-12 |
| 8743561 | Wafer-level molded structure for package assembly | Tsung-Ding Wang, Chien-Hsiun Lee | 2014-06-03 |
| 8426256 | Method of forming stacked-die packages | C. W. Hsiao, Tsung-Ding Wang, Kai-Ming Ching, Chen-Shien Chen, Chien-Hsiun Lee +1 more | 2013-04-23 |
| 8242611 | Bonding metallurgy for three-dimensional interconnect | Dean Wang | 2012-08-14 |
| 7851346 | Bonding metallurgy for three-dimensional interconnect | Dean Wang | 2010-12-14 |
| 7687311 | Method for producing stackable dies | Tsung-Ding Wang | 2010-03-30 |